公开(公告)号：US20230347450A1

公开(公告)日：2023-11-02

申请号：US18006523

申请日：2021-07-19

Applicant: BYD COMPANY LIMITED

Inventor： Xinjun JIANG ,  Xiaobo TANG ,  Xiaoyong ZHANG ,  Jian ZHANG ,  Jianjun WANG

IPC: B23K26/38 ,  H01M4/139 ,  H01M4/04

CPC classification number: B23K26/38 ,  H01M4/139 ,  H01M4/0471

Abstract: The present disclosure discloses a method and device for forming a groove on an electrode plate. The method for forming a groove on an electrode plate includes: thinning an active material layer by a laser method, where the active material layer is located in a to-be-grooved area of the electrode plate; and removing the thinned active material layer by a physical removal method to form an accommodating groove that exposes the current collector layer. By adopting a combination of the laser method and the physical removal method, the present disclosure, the present disclosure, on the one hand, can quickly remove the active material layer in the to-be-grooved area, and on the other hand, can avoid damaging the current collector layer. This ensures the processing precision, speeds up the production and improves the product yield.