公开(公告)号：US20150203725A1

公开(公告)日：2015-07-23

申请号：US14598468

申请日：2015-01-16

Applicant: Bostik, Inc.

Inventor： Kevin Stafeil ,  Kelley Gerschke ,  Kyle Gerarden

IPC: C09J153/02

CPC classification number: C09J153/02 ,  C08L53/02 ,  C08L2205/02

Abstract: A hot melt adhesive composed of a styrene-butadiene-styrene polymer having a relatively high diblock content and styrene content, a second styrenic block copolymer having a lower diblock content than the styrene-butadiene-styrene polymer, which is preferably a styrene-isoprene-styrene polymer, together with tackifying resin, and liquid plasticizer. The preferred styrene-butadiene-styrene polymer contains a styrene content of greater than 30 percent and a diblock content greater than 30 percent by weight. When used in conjunction with a styrene-isoprene-styrene polymer, the hot melt composition provides improved peel strength at 5° C., and when used as a pad attachment positioning adhesive, did not exhibit adhesive transfer at 40° C.

Abstract translation: 由具有相对高的二嵌段含量的苯乙烯 - 丁二烯 - 苯乙烯聚合物和苯乙烯含量组成的热熔粘合剂，具有比苯乙烯 - 丁二烯 - 苯乙烯聚合物更低的二嵌段含量的第二苯乙烯嵌段共聚物，其优选为苯乙烯 - 异戊二烯 - 苯乙烯聚合物，增粘树脂和液体增塑剂。 优选的苯乙烯 - 丁二烯 - 苯乙烯聚合物含有大于30％的苯乙烯含量和大于30重量％的二嵌段含量。 当与苯乙烯 - 异戊二烯 - 苯乙烯聚合物一起使用时，热熔组合物在5℃下提供改善的剥离强度，并且当用作垫附着定位粘合剂时，在40℃下不显示粘合剂转移。

公开(公告)号：US11643578B2

公开(公告)日：2023-05-09

申请号：US14598468

申请日：2015-01-16

Applicant: Bostik, Inc.

Inventor： Kevin Stafeil ,  Kelley Gerschke ,  Kyle Gerarden

IPC: C09J153/02 ,  C08L53/02

CPC classification number: C09J153/02 ,  C08L53/02 ,  C08L2205/02 ,  C09J153/02 ,  C08L53/02

Abstract: A hot melt adhesive composed of a styrene-butadiene-styrene polymer having a relatively high diblock content and styrene content, a second styrenic block copolymer having a lower diblock content than the styrene-butadiene-styrene polymer, which is preferably a styrene-isoprene-styrene polymer, together with tackifying resin, and liquid plasticizer. The preferred styrene-butadiene-styrene polymer contains a styrene content of greater than 30 percent and a diblock content greater than 30 percent by weight. When used in conjunction with a styrene-isoprene-styrene polymer, the hot melt composition provides improved peel strength at 5° C., and when used as a pad attachment positioning adhesive, did not exhibit adhesive transfer at 40° C.