公开(公告)号：US20170178794A1

公开(公告)日：2017-06-22

申请号：US15054794

申请日：2016-02-26

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Jinliang Xu ,  Dengyan Zhou ,  John J. Janis

IPC: H01F27/28 ,  H01F41/02 ,  H01F27/26

CPC classification number: H01F27/2847 ,  H01F3/10 ,  H01F27/263 ,  H01F27/292 ,  H01F27/306 ,  H01F41/02

Abstract: A surface mount, power inductor component assembly includes only two different shapes of modular core pieces and a set of windings having the same shape that can be assembled and arranged to have any desired number of non-magnetically coupled windings to accommodate electrical power systems having different numbers of phases of electrical power. The core pieces and windings are vertically elongated to reduce the component footprint on a circuit board yet provide higher power, higher current capability.

公开(公告)号：US09842682B2

公开(公告)日：2017-12-12

申请号：US15054794

申请日：2016-02-26

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Jinliang Xu ,  Dengyan Zhou ,  John J. Janis

IPC: H01F27/24 ,  H01F27/02 ,  H01F27/28 ,  H01F27/26 ,  H01F41/02

CPC classification number: H01F27/2847 ,  H01F3/10 ,  H01F27/263 ,  H01F27/292 ,  H01F27/306 ,  H01F41/02

Abstract: A surface mount, power inductor component assembly includes only two different shapes of modular core pieces and a set of windings having the same shape that can be assembled and arranged to have any desired number of non-magnetically coupled windings to accommodate electrical power systems having different numbers of phases of electrical power. The core pieces and windings are vertically elongated to reduce the component footprint on a circuit board yet provide higher power, higher current capability.