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Patent Agency Ranking
1.发明授权Low profile, surface mount electromagnetic component assembly and methods of manufacture 有权薄型，表面贴装电磁元件组装及制造方法公开(公告)号：US09202617B2
公开(公告)日：2015-12-01
申请号：US14314625
申请日：2014-06-25
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Dengyan Zhou , Yipeng Yan , Robert James Bogert , Brent Alan Elliott
CPC classification number: H01F27/24 , H01F27/2847 , H01F27/292 , H01F27/306 , H01F41/00 , Y10T29/49073
Abstract: A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
Abstract translation: 诸如功率电感器的薄型表面安装电磁元件包括并排布置的第一和第二芯片，并且具有彼此面对的纵向侧壁。 预成型的线圈绕组包括被接收在部件的相对的纵向侧壁的垂直狭槽中的垂直腿部。 在第一和第二磁芯片的顶表面上提供凹陷的凹陷部分并且接收线圈绕组的主绕组部分。 表面安装端子片在第一和第二磁芯片的底表面上延伸。
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2.发明申请公开(公告)号：US20160260536A1
公开(公告)日：2016-09-08
申请号：US15155523
申请日：2016-05-16
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Renford Hanley , Guo Ouyang , Dengyan Zhou , Robert James Bogert , Yipeng Yan
Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.
Abstract translation: 用于电路板的表面贴装功率电感器部件包括磁体，至少一个导电线圈和表面安装端子，用于完成导电线圈和电路板之间的电连接。 主体和表面安装端子之一被配置为容纳与垂直堆叠关系的单独提供的部件，其中单独提供的电路板部件位于电路板和主体之间。
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3.发明申请公开(公告)号：US20170178794A1
公开(公告)日：2017-06-22
申请号：US15054794
申请日：2016-02-26
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Yipeng Yan , Jinliang Xu , Dengyan Zhou , John J. Janis
CPC classification number: H01F27/2847 , H01F3/10 , H01F27/263 , H01F27/292 , H01F27/306 , H01F41/02
Abstract: A surface mount, power inductor component assembly includes only two different shapes of modular core pieces and a set of windings having the same shape that can be assembled and arranged to have any desired number of non-magnetically coupled windings to accommodate electrical power systems having different numbers of phases of electrical power. The core pieces and windings are vertically elongated to reduce the component footprint on a circuit board yet provide higher power, higher current capability.
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4.发明申请LOW PROFILE, SURFACE MOUNT ELECTROMAGNETIC COMPONENT ASSEMBLY AND METHODS OF MANUFACTURE 有权低剖面，表面安装电磁元件组件及其制造方法公开(公告)号：US20150009004A1
公开(公告)日：2015-01-08
申请号：US14314625
申请日：2014-06-25
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Dengyan Zhou , Yipeng Yan , Robert James Bogert , Brent Alan Elliott
CPC classification number: H01F27/24 , H01F27/2847 , H01F27/292 , H01F27/306 , H01F41/00 , Y10T29/49073
Abstract: A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
Abstract translation: 诸如功率电感器的薄型表面安装电磁元件包括并排布置的第一和第二芯片，并且具有彼此面对的纵向侧壁。 预成型的线圈绕组包括被接收在部件的相对的纵向侧壁的垂直狭槽中的垂直腿部。 在第一和第二磁芯片的顶表面上提供凹陷的凹陷部分并且接收线圈绕组的主绕组部分。 表面安装端子片在第一和第二磁芯片的底表面上延伸。
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5.发明授权公开(公告)号：US09842682B2
公开(公告)日：2017-12-12
申请号：US15054794
申请日：2016-02-26
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Yipeng Yan , Jinliang Xu , Dengyan Zhou , John J. Janis
CPC classification number: H01F27/2847 , H01F3/10 , H01F27/263 , H01F27/292 , H01F27/306 , H01F41/02
Abstract: A surface mount, power inductor component assembly includes only two different shapes of modular core pieces and a set of windings having the same shape that can be assembled and arranged to have any desired number of non-magnetically coupled windings to accommodate electrical power systems having different numbers of phases of electrical power. The core pieces and windings are vertically elongated to reduce the component footprint on a circuit board yet provide higher power, higher current capability.
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