公开(公告)号：US20180033519A1

公开(公告)日：2018-02-01

申请号：US15665679

申请日：2017-08-01

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： YAN SHAO ,  PRASATH BALAMURUGAN GANESAN ,  CHINMAYA R. DANDEKAR ,  JAVED ABDURRAZZAQ MAPKAR

IPC: H01B3/47 ,  H01B3/30 ,  H01B3/42

CPC classification number: H01B3/47 ,  H01B3/002 ,  H01B3/30 ,  H01B3/305 ,  H01B3/421

Abstract: The disclosed concept pertains to thermoplastic composites, e.g., nano-filler-polymer systems, for use in insulating and/or encapsulating an electrical component to provide electrical insulation, and a protective barrier from environmental conditions. The thermoplastic composites include a polymer, e.g., polymer matrix, micro-size and/or nano-size filler(s) and additive(s). The filler(s) is specifically selected with the intent of imparting improved dielectric properties to the thermoplastic composite, as compared to the polymer absent of the filler. The additive(s) impart environmental resistive properties to the thermoplastic composite.