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公开(公告)号：US20240076226A1
公开(公告)日：2024-03-07
申请号：US18039532
申请日：2021-12-17
Applicant: Corning Incorporated
Inventor： Dipakbin Qasem Chowdhury , EuiHo Kim , Euisoo Kim , Seong-ryong Ryoo
CPC classification number: C03B33/091 , C03B33/074 , B23K26/38
Abstract: Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being broken due to the weight thereof. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a torch (300) to the predetermined point. The application of the thermal shock includes brining a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while being brought into contact with the edge of the glass substrate (100).
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公开(公告)号：US20200023611A1
公开(公告)日：2020-01-23
申请号：US16585885
申请日：2019-09-27
Applicant: CORNING INCORPORATED
Inventor： Dipakbin Qasem Chowdhury , William Keith Fisher , Kiat Chyai Kang , Michael Aaron McDonald , Chunhe Zhang
Abstract: Laminated structures include a thin glass sheet with a thickness of less than 600 μm being attached to a metal sheet with an adhesive layer including a thickness of about 100 μm or less. These laminated structures can include planar or curved shapes. Methods of manufacturing a laminated structure are also provided including the step of attaching a glass sheet with a thickness of less than 600 μm to a metal sheet with an adhesive layer including a thickness of about 300 μm or less.
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3.发明申请公开(公告)号：US20210305539A1
公开(公告)日：2021-09-30
申请号：US17262375
申请日：2018-07-23
Applicant: CORNING INCORPORATED
Inventor： Dipakbin Qasem Chowdhury , Sergey Anatol'evich Kuchinsky , Dmitri Vladislavovich Kuksenkov , JooYoung Lee , Michal Mlejnek , Hong Yoon
IPC: H01L51/52
Abstract: An organic light emitting diode (OLED) assembly (100), comprising: a diode superstructure (110) comprising a cathode (140), an anode (120) having a refractive index of na, and an organic light emitting semiconductor material (160) interposed between the cathode (140) and the anode (120); and a light diffracting substructure (150) providing a scattering cross section of light from the diode superstructure (110). The light diffracting substructure (150) comprises: a transparent substrate (156), a plurality of nanoparticles (154) in contact with the substrate (156) and having a refractive index of ns, and a planarization layer (152) over the nanoparticles (154) and having a refractive index of np. Further, np is within 25% of na and ns>np In addition, ns>about 1.9.
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公开(公告)号：US11225052B2
公开(公告)日：2022-01-18
申请号：US16585885
申请日：2019-09-27
Applicant: CORNING INCORPORATED
Inventor： Dipakbin Qasem Chowdhury , William Keith Fisher , Kiat Chyai Kang , Michael Aaron McDonald , Chunhe Zhang
Abstract: Laminated structures include a thin glass sheet with a thickness of less than 600 μm being attached to a metal sheet with an adhesive layer including a thickness of about 100 μm or less. These laminated structures can include planar or curved shapes. Methods of manufacturing a laminated structure are also provided including the step of attaching a glass sheet with a thickness of less than 600 μm to a metal sheet with an adhesive layer including a thickness of about 300 μm or less.
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