APPARATUS AND METHOD FOR CUTTING GLASS LAMINATED SUBSTRATE

    公开(公告)号:US20230357069A1

    公开(公告)日:2023-11-09

    申请号:US18017462

    申请日:2021-07-28

    CPC classification number: C03B33/074 B28D1/24 C03B33/03 C03B33/105

    Abstract: Provided is an apparatus for cutting a glass laminated substrate including a glass layer laminated on a substrate and having a first surface, which is a surface of the glass laminated substrate closer to the glass layer, and a second surface, which is a surface that is opposite the first surface. The apparatus includes a support configured to support the glass laminated substrate, a first cutter provided to cut the glass layer from the first surface of the glass laminated substrate, and a second cutter provided to cut the substrate from the first surface of the glass laminated substrate.

    Method for cutting plate-like glass, and cutting device therefor
    5.
    发明授权
    Method for cutting plate-like glass, and cutting device therefor 有权
    切割板状玻璃的方法及其切割装置

    公开(公告)号:US09458047B2

    公开(公告)日:2016-10-04

    申请号:US14007018

    申请日:2011-06-07

    Abstract: Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).

    Abstract translation: 本发明提供一种通过沿着玻璃板(G)的预设切割线(5)进行至少局部加热来切割玻璃板(G)的方法,其特征在于,包括:通过进行玻璃板 至少沿着玻璃板(G)的预设切割线(5)的局部加热,在用于从玻璃板(G)的背面侧支撑的支撑部件(2(8))的状态下, 与预设切割线(5)分离的玻璃板(G)朝向其两侧分开配置,以在预设切割线(8)的背面侧上形成空间(S) )。

    Laser processing method
    8.
    发明授权
    Laser processing method 有权
    激光加工方法

    公开(公告)号:US08802543B2

    公开(公告)日:2014-08-12

    申请号:US14082825

    申请日:2013-11-18

    Abstract: A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.

    Abstract translation: 提供了能够高精度地切割具有各种层叠结构的待处理物体的激光加工方法。 在聚光点P至少位于基板内的状态下,用激光L照射设置在基板前表面上的基板和层叠体的被处理物,以形成由于 至少在衬底内的多光子吸收,并且使改质区域形成切割起点区域。 当沿着切割起点区域切割物体时,可以高精度地切割物体1。

    LASER PROCESSING METHOD
    9.
    发明申请
    LASER PROCESSING METHOD 有权
    激光加工方法

    公开(公告)号:US20140080288A1

    公开(公告)日:2014-03-20

    申请号:US14082825

    申请日:2013-11-18

    Abstract: A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.

    Abstract translation: 提供了能够高精度地切割具有各种层叠结构的待处理物体的激光加工方法。 在聚光点P至少位于基板内的状态下,用激光L照射设置在基板前表面上的基板和层叠体的被处理物,以形成由于 至少在衬底内的多光子吸收,并且使改质区域形成切割起点区域。 当沿着切割起点区域切割物体时,可以高精度地切割物体1。

    Liquid Crystal Substrate Cutting Device and Cutting Method for Liquid Crystal Substrate
    10.
    发明申请
    Liquid Crystal Substrate Cutting Device and Cutting Method for Liquid Crystal Substrate 有权
    液晶基板切割装置及液晶基板切割方法

    公开(公告)号:US20130340583A1

    公开(公告)日:2013-12-26

    申请号:US13575929

    申请日:2012-06-28

    Abstract: The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.

    Abstract translation: 本发明提供一种用于沿着切割线切割液晶基板的液晶基板切割装置,并且液晶基板切割装置包括加热单元和切割单元。 加热单元沿着切割线移动并加热液晶基板以软化在切割线上覆盖的密封剂,并且切割器单元沿着切割线移动以进一步切割液晶基板。 本发明包括用于沿着切割线加热液晶基板的加热单元,以软化切割线上所覆盖的密封剂,使得切割单元能够精确地切割液晶基板,而不会导致切割单元的进给距离的异常 液晶基板破裂。 因此,废品率降低。

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