Abstract:
Methods for protecting an electrochromic stack, individual layers of the electrochromic stack, a first transparent conductor layer, a second transparent conductor layer, one or more bus bars, or a low E layer on a glass substrate. Methods for protecting the outside surfaces of an insulate glass unit including the substrate and one or more mating lites are also described herein. Methods include laminating a sacrificial coating over the substrate and/or the one or more mating lites, and peeling off the sacrificial coating from the substrate and/or the one or more mating lites.
Abstract:
Provided is an apparatus for cutting a glass laminated substrate including a glass layer laminated on a substrate and having a first surface, which is a surface of the glass laminated substrate closer to the glass layer, and a second surface, which is a surface that is opposite the first surface. The apparatus includes a support configured to support the glass laminated substrate, a first cutter provided to cut the glass layer from the first surface of the glass laminated substrate, and a second cutter provided to cut the substrate from the first surface of the glass laminated substrate.
Abstract:
Methods and devices for producing a composite pane having a functional coating are presented. The functional coating is applied to part of a surface of a base pane, and a first pane is cut out from the base pane while introducing a frame-shaped peripheral coating-free region into the functional coating having an inner region that is not adjacent a side edge of the first pane. The surface of the first pane with the functional coating is then bonded via a thermoplastic intermediate layer to a surface of a second pane.
Abstract:
An electronic device is provided with a display such as a liquid crystal display. The display has a layer of liquid crystal material sandwiched between an upper display layer such as a color filter layer and a lower display layer such as a thin-film-transistor layer. An upper polarizer is formed on the upper surface of the color filter layer. A lower polarizer is formed on the lower surface of the thin-film-transistor layer. To protect display layers such as the color filter layer and the thin-film-transistor layer, a coating is deposited on a peripheral edge of the display layer. A laser is used to cut through portions of the polarizer that overhang the display layer while also cutting through the coating on the peripheral edge of the display layer. Following laser trimming operations, the coating is flush with an edge surface of the polarizer.
Abstract:
Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).
Abstract:
Provided is a laminate (1) obtained by integrally laminating glass sheets (4) on both surfaces of a resin sheet (2). The glass sheets (4) have a thickness of 300 μm or less and end surfaces (4a) of the glass sheets (4) are chamfered.
Abstract:
A method of manufacturing a reinforced plate glass by which glass surface strength is sufficiently increased, and a stable quality reinforced plate glass is manufactured at high production efficiency. The reinforced plate glass is formed of an inorganic oxide glass, and is provided with a compression stress layer by chemical reinforcement on plate surfaces opposed to each other in a plate thickness direction. Plate end faces have regions where a compression stress is formed and regions where no compression stress is formed.
Abstract:
A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.
Abstract:
A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.
Abstract:
The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.