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1.发明授权High performance die attach adhesives (DAAs) nanomaterials for high brightness LED 有权用于高亮度LED的高性能贴片粘合剂（DAAs）纳米材料公开(公告)号：US09005485B2
公开(公告)日：2015-04-14
申请号：US13821566
申请日：2012-03-22
申请人： Chenmin Liu , Dong Lu , Xianxin Lang , Bo Wang , Zhiying Li
发明人： Chenmin Liu , Dong Lu , Xianxin Lang , Bo Wang , Zhiying Li
CPC分类号： C09J9/02 , C08G59/4042 , C08G59/68 , C08K3/08 , C09J163/00
摘要： The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.
摘要翻译： 本发明涉及用于包装半导体（包括HB-LED）的一部分芯片附着粘合剂材料的组合物。 本发明的组合物包括形成具有高导热性，低固化温度和高自身寿命温度的材料的导热性导电填料，聚合物基质和溶剂。 本发明还涉及通过将尺寸选择和表面改性的填料配方，聚合物基质和非反应性有机溶剂混合在一起，然后在低温下固化混合物来制备所述组合物的方法。
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2.发明申请HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED 有权高性能胶带（DAAs）高亮度LED的纳米材料公开(公告)号：US20140001414A1
公开(公告)日：2014-01-02
申请号：US13821566
申请日：2012-03-22
申请人： Chenmin Liu , Dong Lu , Xianxin Lang , Bo Wang , Zhiying Li
发明人： Chenmin Liu , Dong Lu , Xianxin Lang , Bo Wang , Zhiying Li
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08G59/4042 , C08G59/68 , C08K3/08 , C09J163/00
摘要： The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.
摘要翻译： 本发明涉及用于包装半导体（包括HB-LED）的一部分芯片附着粘合剂材料的组合物。 本发明的组合物包括形成具有高导热性，低固化温度和高自身寿命温度的材料的导热性导电填料，聚合物基质和溶剂。 本发明还涉及通过将尺寸选择和表面改性的填料配方，聚合物基质和非反应性有机溶剂混合在一起，然后在低温下固化混合物来制备所述组合物的方法。
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