Image capturing module having two light-shielding adhesive layers closing two notches located on lens base, and manufacturing method thereof

    公开(公告)号:US11165940B2

    公开(公告)日:2021-11-02

    申请号:US16685028

    申请日:2019-11-15

    Abstract: An image capturing module includes a long circuit board, a lens base, and two light-shielding adhesive layers. The long circuit board includes a surface having an assembly area. The assembly area has two opposite long sides and two opposite short sides. The assembly area is provided with a light sensor. The two long sides are separated by a specific width. The lens base includes a substrate and two side plates. The two side plates are connected to opposite sides of the substrate and are respectively fixed on the two short sides of the assembly area. A specific spacing is maintained between the substrate and the assembly area to form two notches between the two long sides and the substrate. The width of the substrate and each of the side plates is less than or equal to the specific width. The two light-shielding adhesive layers respectively close the two notches.

    Electronic device and privacy protection module thereof

    公开(公告)号:US10887763B2

    公开(公告)日:2021-01-05

    申请号:US16523251

    申请日:2019-07-26

    Abstract: A privacy protection module applied to an electronic device is disclosed. The electronic device includes a camera module which has a circuit board and a lens. The lens is connected to the circuit board. The privacy protection module includes a case, a hole, a shutter and an actuator. The case covers the camera module. The hole is located on the case and aligned with the lens. The actuator is located on the case and electrically connected to the circuit board; the actuator moves along a first direction or a second direction when the actuator is driven by electronic power. The shutter is next to the hole and connected to the actuator.

    CAMERA DEVICE
    3.
    发明申请

    公开(公告)号:US20250088723A1

    公开(公告)日:2025-03-13

    申请号:US18638156

    申请日:2024-04-17

    Abstract: A camera device includes a circuit board, a photosensitive element, a first adhesive layer, a lens assembly, and second adhesive layer. The photosensitive element has a photosensitive region and a non-photosensitive region around the photosensitive region. The first adhesive layer is adhesively fixed to the photosensitive element and the circuit board. The lens assembly includes a base and a lens disposed on the base, and the lens has an optical axis. The base includes a bottom wall and an extension member extending from the bottom wall. A limiting surface of the extension member overlaps the non-photosensitive region in a direction along the optical axis. The second adhesive layer has a positioning block and a limiting block. The positioning block is adhesively fixed to the bottom wall and the circuit board, and the limiting block is adhesively fixed to the limiting surface and the non-photosensitive region.

    TEMPERATURE SENSING MODULE AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20220291046A1

    公开(公告)日:2022-09-15

    申请号:US17554178

    申请日:2021-12-17

    Abstract: A temperature sensing module includes a hollow base, an infrared temperature sensor, and a condenser lens. The hollow base has a through hole, a first end, and a second end opposite to the first end. The first end has a first opening, the second end has a second end, and the through hole is in communication between the first opening and the second opening. The infrared temperature sensor is disposed in the through hole and adjacent to the second opening. The infrared temperature sensor includes a photosensitive surface, and the photosensitive surface faces the first opening. The condenser lens is disposed in the through hole and adjacent to the first opening. The condenser lens corresponds to the photosensitive surface of the infrared temperature sensor. An electronic device having the temperature sensing module is also provided.

    Electronic device and lens module thereof

    公开(公告)号:US11221542B2

    公开(公告)日:2022-01-11

    申请号:US16738410

    申请日:2020-01-09

    Abstract: An electronic device includes a first housing, a second housing, an accommodating space and a lens module. The second housing is connected to the first housing and includes an arc edge. The accommodating space is formed between the first housing and the second housing and includes an arc area having a position corresponding to the arc edge. The lens module is located in the accommodating space, matches the shape of the accommodating space, and includes a bottom case, a side case, a top case, an internal space and a photography unit. The side case is connected to the bottom case and includes an inclined surface area which is provided in the arc area. The top case is connected to the side case and includes a top opening.

    IMAGE CAPTURING MODULE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200344390A1

    公开(公告)日:2020-10-29

    申请号:US16685028

    申请日:2019-11-15

    Abstract: An image capturing module includes a long circuit board, a lens base, and two light-shielding adhesive layers. The long circuit board includes a surface having an assembly area. The assembly area has two opposite long sides and two opposite short sides. The assembly area is provided with a light sensor. The two long sides are separated by a specific width. The lens base includes a substrate and two side plates. The two side plates are connected to opposite sides of the substrate and are respectively fixed on the two short sides of the assembly area. A specific spacing is maintained between the substrate and the assembly area to form two notches between the two long sides and the substrate. The width of the substrate and each of the side plates is less than or equal to the specific width. The two light-shielding adhesive layers respectively close the two notches.

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