THERMAL CAMERA ASSEMBLY AND CONTROL SYSTEM AND METHOD FOR CONTROLLING AN INDUSTRIAL PRODUCTION PROCESS COMPRISING A THERMAL CAMERA ASSEMBLY

    公开(公告)号:US20220326084A1

    公开(公告)日:2022-10-13

    申请号:US17764809

    申请日:2020-11-20

    IPC分类号: G01J5/04 G01J5/0875 G01J5/02

    摘要: Thermal camera assembly (1) comprising a thermal imaging detector (3) providing thermographic images and/or recordings, a protective casing (2) which houses the thermal imaging detector and includes a window (5) with a transparent screen (6), one or more sensors (15;16;20;32;33) arranged in the protective casing and providing signals indicative of a physical quantity or a state, one or more actuators (8;22;28) arranged in the protective casing, and a control unit (9) which is integrated in the protective casing. The control unit is directly connected to the thermal imaging detector to receive the thermographic images and/or recordings and transmit them to the outside, to the sensors to receive the relative signals, and to the actuators to control the latter according to the signals received. The control unit is able to manage and control the communication between all the components of the thermal camera and the outside. The thermal camera assembly is part of a control system for controlling an industrial production process and is used in a relative control method.

    TEMPERATURE SENSING MODULE AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20220291046A1

    公开(公告)日:2022-09-15

    申请号:US17554178

    申请日:2021-12-17

    摘要: A temperature sensing module includes a hollow base, an infrared temperature sensor, and a condenser lens. The hollow base has a through hole, a first end, and a second end opposite to the first end. The first end has a first opening, the second end has a second end, and the through hole is in communication between the first opening and the second opening. The infrared temperature sensor is disposed in the through hole and adjacent to the second opening. The infrared temperature sensor includes a photosensitive surface, and the photosensitive surface faces the first opening. The condenser lens is disposed in the through hole and adjacent to the first opening. The condenser lens corresponds to the photosensitive surface of the infrared temperature sensor. An electronic device having the temperature sensing module is also provided.

    Microscale In-Situ Imaging Of Dynamic Temperature And Deformation Fields

    公开(公告)号:US20220187133A1

    公开(公告)日:2022-06-16

    申请号:US17424845

    申请日:2020-01-21

    摘要: An embodiment provides a system for measuring temperature and deformation fields of at least a portion of a sample, comprising a visible light camera, an infrared camera, and a beam splitter. The visible light camera is at a first location with respect to the sample and can take a visible light image of at least a portion of the sample at a first time. The infrared camera is at a second location with respect to the sample and can take an infrared image of the at least a portion of the sample at the first time. The beam splitter can receive a beam of light, comprising infrared and visible light, traveling in a direction normal to the at least a portion of the sample and direct the infrared light to the infrared camera and the visible light to the visible light camera.

    Flame detector
    8.
    发明授权

    公开(公告)号:US11619550B2

    公开(公告)日:2023-04-04

    申请号:US16726987

    申请日:2019-12-26

    申请人: ABB Schweiz AG

    IPC分类号: G01J5/00 G01J5/08 G01J5/0875

    摘要: Embodiments of the present disclosure relate to a flame detector. The flame detector comprises a light guide system including a first end and a second end opposite to the first end, a light path being formed between the first end and the second end and extending along an optical axis; a first hole disposed at the first end, extending along the optical axis and forming a part of the light path, the first hole being configured to receive light emitted by a flame to be detected; and a second hole disposed at the second end, extending along the optical axis and forming a part of the light path, sizes of the first and second holes and a length of the light path being configured such that a detection angle of the light guide system is between 0.5 degrees and 3 degrees.

    PASSIVE INFRARED SENSOR SYSTEMS AND METHODS

    公开(公告)号:US20220252457A1

    公开(公告)日:2022-08-11

    申请号:US17620619

    申请日:2020-06-19

    摘要: A passive infrared (PIR) sensor system, includes a PIR sensor configured to produce an output signal in response to receiving infrared (IR) radiation, an electronic shutter positionable in a field of view (FOV) of the PIR sensor, wherein the electronic shutter includes a liquid crystal (LC) material, wherein the electronic shutter includes a first state providing a first transmissivity of IR radiation through the electronic shutter and a second state providing a second transmissivity of IR radiation through the electronic shutter that is less than the first transmissivity, and a shutter actuator configured to apply an actuation signal to the electronic shutter to actuate the electronic shutter between the first state and the second state.