公开(公告)号：US09467777B2

公开(公告)日：2016-10-11

申请号：US13844744

申请日：2013-03-15

Applicant: Cirrus Logic, Inc.

Inventor： Eric J. Swanson ,  Ed Schneider

IPC: H04R3/00

CPC classification number: H04R3/005

Abstract: An interface for an array of digital microphones in an electronic device may include a head-end chip coupled to the digital microphones through a bus. The bus may be shared by each microphone of the array of microphones and be multiplexed to allow transmission of data from the microphones to the head-end chip and transmission of power from the head-end chip to the array of digital microphones. The head-end chip may perform signal processing on receive data from the array of digital microphones to create beamforming arrays. The array of microphones may include microphones with different characteristics to improve performance of the array of microphones.

Abstract translation: 用于电子设备中的数字麦克风阵列的接口可以包括通过总线耦合到数字麦克风的头端芯片。 总线可以由麦克风阵列的每个麦克风共享，并被复用以允许数据从麦克风传输到头端芯片，并将功率从头端芯片传输到数字麦克风阵列。 前端芯片可以对来自数字麦克风阵列的接收数据执行信号处理，以创建波束成形阵列。 麦克风阵列可以包括具有不同特性的麦克风，以改善麦克风阵列的性能。

公开(公告)号：US20140270246A1

公开(公告)日：2014-09-18

申请号：US13844744

申请日：2013-03-15

Applicant: Cirrus Logic, Inc.

Inventor： Eric J. Swanson ,  Ed Schneider

IPC: H04R3/00

CPC classification number: H04R3/005

Abstract: An interface for an array of digital microphones in an electronic device may include a head-end chip coupled to the digital microphones through a bus. The bus may be shared by each microphone of the array of microphones and be multiplexed to allow transmission of data from the microphones to the head-end chip and transmission of power from the head-end chip to the array of digital microphones. The head-end chip may perform signal processing on receive data from the array of digital microphones to create beamforming arrays. The array of microphones may include microphones with different characteristics to improve performance of the array of microphones.

Abstract translation: 用于电子设备中的数字麦克风阵列的接口可以包括通过总线耦合到数字麦克风的头端芯片。 总线可以由麦克风阵列的每个麦克风共享，并被复用以允许数据从麦克风传输到头端芯片，并将功率从头端芯片传输到数字麦克风阵列。 前端芯片可以对来自数字麦克风阵列的接收数据执行信号处理，以创建波束成形阵列。 麦克风阵列可以包括具有不同特性的麦克风，以改善麦克风阵列的性能。

公开(公告)号：US09467778B2

公开(公告)日：2016-10-11

申请号：US13844802

申请日：2013-03-16

Applicant: Cirrus Logic, Inc.

Inventor： Eric J. Swanson ,  Ed Schneider

IPC: H04R3/00

CPC classification number: H04R3/005

Abstract: An interface for an array of digital microphones in an electronic device may include a head-end chip coupled to the digital microphones through a bus. The bus may be shared by each microphone of the array of microphones and be multiplexed to allow transmission of data from the microphones to the head-end chip and transmission of power from the head-end chip to the array of digital microphones. The head-end chip may perform signal processing on receive data from the array of digital microphones to create beamforming arrays. The array of microphones may include microphones with different characteristics to improve performance of the array of microphones.

Abstract translation: 用于电子设备中的数字麦克风阵列的接口可以包括通过总线耦合到数字麦克风的头端芯片。 总线可以由麦克风阵列的每个麦克风共享，并被复用以允许数据从麦克风传输到头端芯片，并将功率从头端芯片传输到数字麦克风阵列。 前端芯片可以对来自数字麦克风阵列的接收数据执行信号处理，以创建波束成形阵列。 麦克风阵列可以包括具有不同特性的麦克风，以改善麦克风阵列的性能。

公开(公告)号：US20140270247A1

公开(公告)日：2014-09-18

申请号：US13844802

申请日：2013-03-16

Applicant: Cirrus Logic, Inc.

Inventor： Eric J. Swanson ,  Ed Schneider

IPC: H04R3/00

CPC classification number: H04R3/005

Abstract: An interface for an array of digital microphones in an electronic device may include a head-end chip coupled to the digital microphones through a bus. The bus may be shared by each microphone of the array of microphones and be multiplexed to allow transmission of data from the microphones to the head-end chip and transmission of power from the head-end chip to the array of digital microphones. The head-end chip may perform signal processing on receive data from the array of digital microphones to create beamforming arrays. The array of microphones may include microphones with different characteristics to improve performance of the array of microphones.

Abstract translation: 用于电子设备中的数字麦克风阵列的接口可以包括通过总线耦合到数字麦克风的头端芯片。 总线可以由麦克风阵列的每个麦克风共享，并被复用以允许数据从麦克风传输到头端芯片，并将功率从头端芯片传输到数字麦克风阵列。 前端芯片可以对来自数字麦克风阵列的接收数据执行信号处理，以创建波束成形阵列。 麦克风阵列可以包括具有不同特性的麦克风，以改善麦克风阵列的性能。