公开(公告)号：US20240337870A1

公开(公告)日：2024-10-10

申请号：US18297321

申请日：2023-04-07

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Ming Gai Stanley LO ,  Mark A. WEBSTER ,  Farnood KHALILZADEH REZAIE

IPC: G02F1/015

CPC classification number: G02F1/0154 ,  G02F2201/063 ,  G02F2202/20

Abstract: Embodiments herein describe a photonic platform having a chiplet with a Pockels effect electro-optic layer made of LN or BTO and a substrate. The chiplet is bonded to a photonic wafer which includes a waveguide. In this manner, a ridge waveguide formed by the Pockels effect electro-optic layer and the waveguide utilizes electro-optic effects to tune a signal.