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公开(公告)号：US20250151198A1
公开(公告)日：2025-05-08
申请号：US18434943
申请日：2024-02-07
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Elizabeth Kochuparambil , Scott Hinaga , Kameron Rose Hurst , Mike Sapozhnikov , Shobhana Punjabi , David Nozadze , Marco Croci
Abstract: Techniques to move high current power distribution layers for integrated circuit core power and serializer-deserializer (SERDES) power into a center area of the integrated circuit footprint. This provides a more reliable and higher current distribution into the center of a large integrated circuit footprint, without causing disruption of high speed signal routing or increased signal integrity burden to the high speed signals. Arrangements and methods for routing out the core power area of a main printed circuit board under an integrated circuit and replacing it with a custom power printed circuit board (power plug) that is attached by a metalized paste sintering process. This provides a more reliable and higher current distribution into the center of a large integrated circuit or other high-power component, without causing disruption of high speed signal routing.
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公开(公告)号：US20250147256A1
公开(公告)日：2025-05-08
申请号：US18434252
申请日：2024-02-06
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Giovanni Giobbio , Krishnagopal Goswami , Prashanth Pavithran , Marco Croci , Meir Peleg , Vic Hong Chia , Hua Yang , Mete Yilmaz , Xin Mao
Abstract: A device is provided that includes a printed circuit board and an integrated circuit that is installed on the printed circuit board. A plurality of optical transceiver modules are positioned on the printed circuit board around three or more sides of the integrated circuit. The plurality of optical transceiver modules are to be in operable communication with the integrated circuit. A faceplate is installed that has multiple face portions that expose receptacles for the plurality of optical transceiver modules around the integrated circuit.
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