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1.发明公开公开(公告)号：US20230354505A1
公开(公告)日：2023-11-02
申请号：US18337724
申请日：2023-06-20
发明人： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC分类号： H05K1/02
CPC分类号： H05K1/0239 , H05K1/0242 , H05K2201/09245
摘要： A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).
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公开(公告)号：US11706870B2
公开(公告)日：2023-07-18
申请号：US17503690
申请日：2021-10-18
发明人： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
CPC分类号： H05K1/09 , H05K3/4644 , H05K2201/0323 , H05K2201/0338 , H05K2203/1545
摘要： A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US20210337666A1
公开(公告)日：2021-10-28
申请号：US17006016
申请日：2020-08-28
发明人： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
摘要： A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
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公开(公告)号：US11751322B2
公开(公告)日：2023-09-05
申请号：US17703051
申请日：2022-03-24
发明人： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC分类号： H05K1/02
CPC分类号： H05K1/0239 , H05K1/0242 , H05K2201/09245
摘要： A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
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公开(公告)号：US11330702B2
公开(公告)日：2022-05-10
申请号：US17079970
申请日：2020-10-26
发明人： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC分类号： H05K1/02
摘要： A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
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公开(公告)号：US20210337657A1
公开(公告)日：2021-10-28
申请号：US17079970
申请日：2020-10-26
发明人： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC分类号： H05K1/02
摘要： A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
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7.发明申请公开(公告)号：US20140119703A1
公开(公告)日：2014-05-01
申请号：US13661095
申请日：2012-10-26
发明人： Scott Hinaga , David Senk , Brice Achkir
CPC分类号： G02B6/138 , G02B6/1221 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K2201/0187 , Y10T156/10 , Y10T156/1082
摘要： A printed circuit board (PCB) may be provided. The PCB may comprise a first electrically conductive layer comprising a first signal layer. Also, the PCB may comprise a second electrically conductive layer comprising a second signal layer or a plane layer associated with the first signal layer. The PCB may further comprise a waveguide layer disposed between the first electrically conductive layer and adjacent the second electrically conductive layer. The waveguide layer may transmit optical signals and function as a dielectric between the first electrically conductive layer and the second electrically conductive layer.
摘要翻译： 可以提供印刷电路板（PCB）。 PCB可以包括包括第一信号层的第一导电层。 而且，PCB可以包括第二导电层，其包括与第一信号层相关联的第二信号层或平面层。 PCB还可以包括布置在第一导电层之间并且邻近第二导电层的波导层。 波导层可以传输光学信号并且用作第一导电层和第二导电层之间的电介质。
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8.发明公开公开(公告)号：US20230269873A1
公开(公告)日：2023-08-24
申请号：US18305489
申请日：2023-04-24
发明人： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
CPC分类号： H05K1/09 , H05K3/4644 , H05K2203/1545 , H05K2201/0323 , H05K2201/0338
摘要： A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US20220217837A1
公开(公告)日：2022-07-07
申请号：US17703051
申请日：2022-03-24
发明人： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC分类号： H05K1/02
摘要： A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
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10.发明申请公开(公告)号：US20220039257A1
公开(公告)日：2022-02-03
申请号：US17503690
申请日：2021-10-18
发明人： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
摘要： A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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