公开(公告)号：US20020105714A1

公开(公告)日：2002-08-08

申请号：US09778712

申请日：2001-02-08

Applicant: Codeon Corporation

Inventor： Ganesh K. Gopalakrishnan ,  Kevin G. Donovan ,  Richard C. Blanchard

IPC: G02F001/03 ,  G02F001/07

CPC classification number: G02F1/0316 ,  G02F1/0356

Abstract: An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected on a surface of the optical modulator chip.

Abstract translation: 光学装置包括接地基座和具有顶表面，后表面和侧表面的光调制器芯片。 光调制器芯片位于接地底座上，后表面面向接地底座。 光调制器芯片包括位于光调制器芯片顶表面上的第一接地电极，信号电极和第二接地电极。 光调制器芯片的第一和第二接地电极在光调制器芯片的表面上互连。

公开(公告)号：US20020054417A1

公开(公告)日：2002-05-09

申请号：US09885136

申请日：2001-06-21

Applicant: Codeon Corporation

Inventor： Ganesh K. Gopalakrishnan ,  Kevin G. Donovan ,  Richard C. Blanchard

IPC: G02F001/03 ,  G02F001/07

CPC classification number: G02F1/0316 ,  G02F1/0356

Abstract: An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected with resistive layers on a surface of the optical modulator chip.

Abstract translation: 光学装置包括接地基座和具有顶表面，后表面和侧表面的光调制器芯片。 光调制器芯片位于接地底座上，后表面面向接地底座。 光调制器芯片包括位于光调制器芯片顶表面上的第一接地电极，信号电极和第二接地电极。 光调制器芯片的第一和第二接地电极与光调制器芯片的表面上的电阻层互连。