公开(公告)号：US20200039280A1

公开(公告)日：2020-02-06

申请号：US16594591

申请日：2019-10-07

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Luis J. DaSilva

IPC: B42D25/46 ,  B32B15/08 ,  B32B27/08 ,  B32B27/30 ,  B32B38/06 ,  B42D25/425 ,  B32B27/06 ,  B32B27/36 ,  B32B3/30 ,  B32B27/32 ,  B42D25/00

Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.

公开(公告)号：US12151502B2

公开(公告)日：2024-11-26

申请号：US16594591

申请日：2019-10-07

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Luis J. DaSilva

IPC: B32B3/30 ,  B32B15/08 ,  B32B27/06 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B38/06 ,  B42D25/00 ,  B42D25/425 ,  B42D25/46 ,  B32B37/00 ,  B32B37/02 ,  B32B38/00 ,  B32B38/14 ,  B42D25/328 ,  B42D25/45

Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.