公开(公告)号：US20230373916A1

公开(公告)日：2023-11-23

申请号：US18030720

申请日：2021-10-05

Applicant: DAICEL CORPORATION

Inventor： Yoshimichi OKANO ,  Takeshi ASADA

IPC: C07D207/452 ,  C09J133/06 ,  C08F22/06 ,  C08G65/333 ,  C08G65/48 ,  B32B27/06 ,  B32B27/42

CPC classification number: C07D207/452 ,  C09J133/064 ,  C08F22/06 ,  C08G65/333 ,  C08G65/48 ,  B32B27/06 ,  B32B27/42

Abstract: Provided is a curable compound product having excellent storage stability that is rapidly cured upon heating to form a cured product having ultra-high heat resistance. The curable compound product according to the present disclosure has the following characteristics (a) to (e): (a) A number average molecular weight (calibrated with polystyrene standard) is from 1000 to 15000. (b) A proportion of a structure derived from an aromatic ring in a total amount of the curable compound product is 50 wt. % or greater. (c) Solvent solubility at 23° C. is 1 g/100 g or greater. (d) The glass transition temperature is from 80 to 230° C. (e) A viscosity (η0) of a 20 wt. % NMP solution obtained by subjecting the curable compound product to a reduced-pressure drying process and then dissolving the reduced-pressure-dried curable compound product in NMP, and a viscosity (η10) of the 20 wt. % NMP solution after being left to stand for 10 days in a desiccator maintained at 23° C. satisfy the Equation (E): η10/η0