CURABLE COMPOUND PRODUCT
    3.
    发明公开

    公开(公告)号:US20240026076A1

    公开(公告)日:2024-01-25

    申请号:US18030697

    申请日:2021-10-05

    摘要: Provided is a curable compound product having excellent storage stability and moldability and by which a cured product having ultra-high heat resistance can be formed. The curable compound product according to the present disclosure has the following characteristics (a) to (g): (a) A number average molecular weight (calibrated with polystyrene standard) is from 1000 to 15000. (b) A proportion of a structure derived from an aromatic ring in a total amount of the curable compound product is 50 wt. % or greater. (c) Solvent solubility at 23° C. is 1 g/100 g or greater. (d) The glass transition temperature is from 80 to 230° C. (e) A viscosity (η0) of a 20 wt. % NMP solution obtained by subjecting the curable compound product to a reduced-pressure drying process and then dissolving the reduced-pressure-dried curable compound product in NMP, and a viscosity (η10) of the 20 wt. % NMP solution after being left to stand for 10 days in a desiccator maintained at 23° C. satisfy the Equation (E): η10/η0

    CURABLE COMPOUND PRODUCT
    5.
    发明公开

    公开(公告)号:US20240067777A1

    公开(公告)日:2024-02-29

    申请号:US18269431

    申请日:2020-12-25

    IPC分类号: C08G65/48 C08G65/40 C08J7/052

    摘要: The present invention provides a curable compound product that forms a cured product having excellent heat resistance and high insulating properties by performing heat treatment. The curable compound product of the present disclosure contains a compound represented by Formula (1) below, and a proportion of a group represented by Formula (r-1) below to the sum of the group represented by Formula (r-1) below and a group represented by Formula (r-2) below is 97% or greater. In Formula (1), R1 and R2 are identical or different, and each represent the group represented by Formula (r-1) the group represented by Formula (r-2) below: D1 and D2 are identical or different, and each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below.

    CURABLE COMPOUND PRODUCT
    6.
    发明公开

    公开(公告)号:US20230373916A1

    公开(公告)日:2023-11-23

    申请号:US18030720

    申请日:2021-10-05

    摘要: Provided is a curable compound product having excellent storage stability that is rapidly cured upon heating to form a cured product having ultra-high heat resistance. The curable compound product according to the present disclosure has the following characteristics (a) to (e): (a) A number average molecular weight (calibrated with polystyrene standard) is from 1000 to 15000. (b) A proportion of a structure derived from an aromatic ring in a total amount of the curable compound product is 50 wt. % or greater. (c) Solvent solubility at 23° C. is 1 g/100 g or greater. (d) The glass transition temperature is from 80 to 230° C. (e) A viscosity (η0) of a 20 wt. % NMP solution obtained by subjecting the curable compound product to a reduced-pressure drying process and then dissolving the reduced-pressure-dried curable compound product in NMP, and a viscosity (η10) of the 20 wt. % NMP solution after being left to stand for 10 days in a desiccator maintained at 23° C. satisfy the Equation (E): η10/η0

    CURABLE COMPOUND
    7.
    发明申请
    CURABLE COMPOUND 审中-公开

    公开(公告)号:US20200079726A1

    公开(公告)日:2020-03-12

    申请号:US16470057

    申请日:2017-11-10

    摘要: There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R1 and R2 each represent a curable functional group; D1 and D2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar1 to Ar3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO2—; each Y represents —S—, —SO2—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more):