公开(公告)号：US20240064895A1

公开(公告)日：2024-02-22

申请号：US18271284

申请日：2022-03-22

Applicant: DENKA COMPANY LIMITED

Inventor： Kenji MIYATA ,  Shohji IWAKIRI ,  Saori INOUE

IPC: H05K1/03 ,  H05K3/46 ,  C04B37/00 ,  C04B37/02

CPC classification number: H05K1/0306 ,  H05K3/4644 ,  C04B37/001 ,  C04B37/021 ,  H05K2201/0175 ,  H05K2203/085 ,  C04B2237/361 ,  C04B2237/68

Abstract: A circuit board having electrodes has good thermal conductivity and excellent voltage resistance and a method of producing the same. The circuit board includes a first ceramic layer, a second ceramic layer laminated thereon, and a first metal layer between the ceramic layers. The circuit board has a metal layer existing zone between the ceramic layers, and a metal layer non-existing zone having no metal layer between the ceramic layers. The ceramic layers join in the metal layer non-existing zone, and the second ceramic layer is a porous boron nitride layer having voids filled with a thermosetting composition cured material. The method includes disposing a second ceramic sheet on a first laminate metal layer including a first ceramic layer and the first metal layer laminated thereon, and pressurizing under heating. The second ceramic sheet is a porous boron nitride sheet having voids filled with a thermosetting composition semi-cured material.