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公开(公告)号：US20230271888A1
公开(公告)日：2023-08-31
申请号：US17998687
申请日：2021-05-13
Applicant: Denka Company Limited
Inventor： Nobuya SUZUKI , Saori INOUE , Yasuhisa UESHIMA , Ryo YOSHIMATSU , Ryuji KOGA
CPC classification number: C04B41/4884 , B29C39/10 , C04B35/583 , C04B41/0063 , C04B41/83 , C04B41/4521 , C04B41/4525 , H01L33/641
Abstract: One aspect of the present disclosure provides a production method for a composite, the method including: a cooling step of performing cooling under a pressurized condition in a state where a heated molten material of a thermosetting composition is brought into contact with a resin-impregnated body, in which the above-described resin-impregnated body includes a nitride sintered body having a porous structure and a semi-cured product of the thermosetting composition impregnated into the above-described nitride sintered body.
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公开(公告)号：US20240064895A1
公开(公告)日：2024-02-22
申请号：US18271284
申请日：2022-03-22
Applicant: DENKA COMPANY LIMITED
Inventor： Kenji MIYATA , Shohji IWAKIRI , Saori INOUE
CPC classification number: H05K1/0306 , H05K3/4644 , C04B37/001 , C04B37/021 , H05K2201/0175 , H05K2203/085 , C04B2237/361 , C04B2237/68
Abstract: A circuit board having electrodes has good thermal conductivity and excellent voltage resistance and a method of producing the same. The circuit board includes a first ceramic layer, a second ceramic layer laminated thereon, and a first metal layer between the ceramic layers. The circuit board has a metal layer existing zone between the ceramic layers, and a metal layer non-existing zone having no metal layer between the ceramic layers. The ceramic layers join in the metal layer non-existing zone, and the second ceramic layer is a porous boron nitride layer having voids filled with a thermosetting composition cured material. The method includes disposing a second ceramic sheet on a first laminate metal layer including a first ceramic layer and the first metal layer laminated thereon, and pressurizing under heating. The second ceramic sheet is a porous boron nitride sheet having voids filled with a thermosetting composition semi-cured material.
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公开(公告)号：US20230227370A1
公开(公告)日：2023-07-20
申请号：US17998690
申请日：2021-05-13
Applicant: Denka Company Limited
Inventor： Nobuya SUZUKI , Saori INOUE , Yasuhisa UESHIMA , Ryo YOSHIMATSU , Ryuji KOGA
CPC classification number: C04B37/021 , C04B35/583 , C04B41/83 , C04B41/4884 , B32B3/26 , B32B9/005 , B32B9/041 , C04B2237/361 , C04B2237/407 , C04B2237/52 , H01L33/641
Abstract: One aspect of the present disclosure provides a composite body including: a nitride sintered body having a porous structure; and a semi-cured product of a thermosetting composition impregnated into the above-described nitride sintered body, in which dielectric breakdown voltage is 4.5 kV or higher.
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公开(公告)号：US20210032171A1
公开(公告)日：2021-02-04
申请号：US16766954
申请日：2018-12-05
Applicant: DENKA COMPANY LIMITED
Inventor： Yoshitaka MINAKATA , Eri SASAKI , Toshitaka YAMAGATA , Saori INOUE , Ryo YOSHIMATU , Ryuji KOGA
Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
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公开(公告)号：US20230122917A1
公开(公告)日：2023-04-20
申请号：US17907462
申请日：2021-03-29
Applicant: Denka Company Limited
Inventor： Eri KANEKO , Mana OKI , Saori INOUE , Kohji TSUJI
IPC: C04B41/48 , C04B35/583 , C04B35/645 , C04B38/00 , C04B41/00 , C04B41/83 , C08G59/50 , C08G59/42 , C08G59/68
Abstract: An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.
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Patent Agency Ranking
公开(公告)号：US20220194870A1
公开(公告)日：2022-06-23
申请号：US17441756
申请日：2020-03-25
Applicant: Denka Company Limited
Inventor： Yoshitaka MINAKATA , Eri SASAKI , Saori INOUE , Mana OKI
Abstract: The present disclosure provides a composite including a nitride sintered body having a porous structure and a semi-cured product of a heat-curable composition impregnated into the nitride sintered body, wherein a dielectric breakdown voltage obtainable after disposing the composite between adherends, heating and pressurizing the composite for 5 minutes under the conditions of 200° C. and 10 MPa, and further heating the composite for 2 hours under the conditions of 200° C. and atmospheric pressure, is greater than 5 kV.
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公开(公告)号：US20220177375A1
公开(公告)日：2022-06-09
申请号：US17441763
申请日：2020-03-26
Applicant: Denka Company Limited
Inventor： Saori INOUE , Shoji IWAKIRI , Yoshitaka MINAKATA , Ryo YOSHIMATSU , Ryuji KOGA , Tomoya YAMAGUCHI
IPC: C04B35/583 , C04B41/83
Abstract: One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 μm or less.
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公开(公告)号：US20200031723A1
公开(公告)日：2020-01-30
申请号：US16498648
申请日：2018-03-28
Applicant: DENKA COMPANY LIMITED
Inventor： Saori INOUE , Toshitaka YAMAGATA , Yoshitaka MINAKATA , Ryo YOSHIMATSU , Ryuji KOGA
IPC: C04B35/583 , C04B41/83 , H01L23/373 , H01L23/34
Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
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9.发明申请公开(公告)号：US20220410530A1
公开(公告)日：2022-12-29
申请号：US17770513
申请日：2020-10-21
Applicant: Denka Company Limited
Inventor： Yoshitaka MINAKATA , Tomoya YAMAGUCHI , Saori INOUE
Abstract: One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 μm or less.
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公开(公告)号：US20220250994A1
公开(公告)日：2022-08-11
申请号：US17441746
申请日：2020-03-26
Applicant: Denka Company Limited
Inventor： Saori INOUE , Shoji IWAKIRI , Yoshitaka MINAKATA , Ryo YOSHIMATSU , Ryuji KOGA , Tomoya YAMAGUCHI
IPC: C04B41/48 , C04B35/583 , C04B38/00
Abstract: One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.
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