公开(公告)号：US20220326283A1

公开(公告)日：2022-10-13

申请号：US17849947

申请日：2022-06-27

Applicant: DENSO CORPORATION

Inventor： Akito SASAKI ,  Ryosuke SAKAI ,  Hiroaki MIWA ,  Takeshi TSUKAMOTO ,  Hiroshi NOMURA ,  Takuma ESAKA ,  Tatsuaki SUGITO

IPC: G01R15/20 ,  G01R19/00

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

公开(公告)号：US20210003615A1

公开(公告)日：2021-01-07

申请号：US17023568

申请日：2020-09-17

Applicant: DENSO CORPORATION

Inventor： Akito SASAKI ,  Ryosuke SAKAI ,  Hiroaki MIWA ,  Takeshi TSUKAMOTO ,  Hiroshi NOMURA ,  Takuma ESAKA ,  Tatsuaki SUGITO

IPC: G01R15/20 ,  G01R19/00

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.