公开(公告)号：US20220024279A1

公开(公告)日：2022-01-27

申请号：US17410103

申请日：2021-08-24

Applicant: DENSO CORPORATION

Inventor： Yasuteru FUKUI ,  Nobuharu KAKEHASHI ,  Tomohiro HAYASE

IPC: B60H1/00 ,  B60H1/14

Abstract: A heat management system includes a high-temperature heat medium circuit, a low-temperature heat medium circuit, a circuit connection part, and a circuit switching part. The high-temperature heat medium circuit connects a heat medium and refrigerant heat exchanger and a heater core. The low-temperature heat medium circuit connects a radiator and a heat generation equipment. The circuit connection part connects the high-temperature heat medium circuit and the low-temperature heat medium circuit such that the heat medium can flow in and out. The heat management system is switched by the circuit switching part between an operation mode in which the heat medium heated by the heat medium and refrigerant heat exchanger is circulated through the heater core and an operation mode in which the heat medium heated by the heat generation equipment and the heat medium and refrigerant heat exchanger is circulated through the heater core.

公开(公告)号：US20220410652A1

公开(公告)日：2022-12-29

申请号：US17898660

申请日：2022-08-30

Applicant: DENSO CORPORATION

Inventor： Tomohiro HAYASE ,  Nobuharu KAKEHASHI

IPC: B60H1/00

Abstract: A thermal management system includes a high-temperature side heating medium circuit, a low-temperature side heating medium circuit, a device heating medium circuit, a circuit connection portion and a circuit switch unit. The circuit switch unit switches between an operation mode in which a heating medium that passed through the low-temperature side heating medium circuit is circulated through any one of the high-temperature side heating medium circuit and the device heating medium circuit via the circuit connection portion and an operation mode in which the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit are connected via the circuit connection portion, and the heating medium is circulated through a heat generation device, a device heat exchange unit, a heating unit, and a heater core.