公开(公告)号：US11557562B2

公开(公告)日：2023-01-17

申请号：US16343380

申请日：2017-10-18

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi Miyake ,  Reiji Tsukao ,  Tatsurou Fukaya

IPC: H01L23/00 ,  C09J7/30 ,  C09J5/00 ,  C09J9/02

Abstract: An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

公开(公告)号：US11001686B2

公开(公告)日：2021-05-11

申请号：US16344489

申请日：2017-10-27

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi Miyake ,  Shoko Kuga ,  Reiji Tsukao

IPC: C08J5/18 ,  C09J7/38 ,  B32B7/022 ,  B32B27/08 ,  B32B27/20 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  H01R4/04 ,  C08K9/02 ,  C08K3/08

Abstract: A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

公开(公告)号：US10269467B2

公开(公告)日：2019-04-23

申请号：US15741135

申请日：2016-07-11

Applicant: DEXERIALS CORPORATION

Inventor： Reiji Tsukao ,  Takeshi Miyake

IPC: H01B5/16 ,  C09J7/29 ,  C09J7/30 ,  B32B7/12 ,  C09J9/02 ,  H01R11/01 ,  H01L31/0224

Abstract: An anisotropic conductive film is thermo-polymerizable and includes an electrically insulating base layer, an adhesive layer, an intermediate layer sandwiched therebetween, and electrically conductive particles retained by any of the layers. The intermediate layer and the adhesive layer each have a melt viscosity higher than the melt viscosity of the electrically insulating base layer. The electrically conductive particles are independent of one another when the anisotropic conductive film is viewed in plan. The modulus of elasticity of the anisotropic conductive film as a whole, at 100° C., after thermal polymerization, is higher than 1800 MPa.