公开(公告)号：US20190148132A1

公开(公告)日：2019-05-16

申请号：US16184022

申请日：2018-11-08

申请人： DISCO CORPORATION

发明人： Hideji HORITA ,  Sakae MATSUZAKI ,  Noriko ITO ,  Norihisa ARIFUKU ,  Setsusei REI ,  Akihito KAWAI ,  Mai OGASAWARA

IPC分类号： H01L21/02 ,  H01L23/544

摘要： A method of manufacturing a small-diameter wafer from a wafer having one face and the other face, the one face being mirror-polished, is provided. The method includes a protective member covering step of covering the one face of the wafer with a first protective member and the other face of the wafer with a second protective member, a cut-out step of cutting out a plurality of small-diameter wafers from the wafer covered with the first protective member and the second protective member, a chamfering step of chamfering an outer periphery portion of each of the plurality of small-diameter wafers, and a protective member removing step of removing the first protective member and the second protective member from each of the plurality of small-diameter wafers.