公开(公告)号：US20190148132A1

公开(公告)日：2019-05-16

申请号：US16184022

申请日：2018-11-08

申请人： DISCO CORPORATION

发明人： Hideji HORITA ,  Sakae MATSUZAKI ,  Noriko ITO ,  Norihisa ARIFUKU ,  Setsusei REI ,  Akihito KAWAI ,  Mai OGASAWARA

IPC分类号： H01L21/02 ,  H01L23/544

摘要： A method of manufacturing a small-diameter wafer from a wafer having one face and the other face, the one face being mirror-polished, is provided. The method includes a protective member covering step of covering the one face of the wafer with a first protective member and the other face of the wafer with a second protective member, a cut-out step of cutting out a plurality of small-diameter wafers from the wafer covered with the first protective member and the second protective member, a chamfering step of chamfering an outer periphery portion of each of the plurality of small-diameter wafers, and a protective member removing step of removing the first protective member and the second protective member from each of the plurality of small-diameter wafers.

公开(公告)号：US20210011387A1

公开(公告)日：2021-01-14

申请号：US16915075

申请日：2020-06-29

申请人： DISCO CORPORATION

发明人： Sakae MATSUZAKI

IPC分类号： G03F7/40 ,  H01L21/027 ,  G03F7/16 ,  G03F7/039 ,  G03F7/038 ,  G03F7/20 ,  G03F7/32

摘要： A method of forming an insulating layer on a first interconnect layer formed on a first surface of a wafer includes a step of coating an upper surface of the first interconnect layer and the upper surface of the wafer with a thermosetting resin, a step of modifying predetermined regions of the thermosetting resin into modified resin portions, a step of dissolving the modified resin portions modified in the modifying step with a chemical solution and thereafter removing the dissolved modified resin portions by supplying a cleaning fluid to the wafer, a step of accommodating the wafer into a hermetically sealable chamber, hermetically sealing the chamber, and making the chamber free of oxygen, and a step of heating the wafer accommodated in the chamber that has been made free of oxygen to thermoset the thermosetting resin.

公开(公告)号：US20190181029A1

公开(公告)日：2019-06-13

申请号：US16210139

申请日：2018-12-05

申请人： DISCO CORPORATION

发明人： Sakae MATSUZAKI

IPC分类号： H01L21/683 ,  H01L21/78

摘要： A method of manufacturing device chips includes the steps of placing a workpiece on a table with a sheet of an insulating material being interposed between the table and the workpiece, attracting the sheet to the workpiece under electrostatic forces by applying a voltage between electrodes in the table to polarize the workpiece and the sheet, unloading the workpiece with the sheet attracted thereto from the table, processing the workpiece with the sheet attracted thereto to divide the workpiece into a plurality of device chips that correspond respectively to devices, and peeling off the device chips from the sheet by bringing an electrically conductive probe into contact with one, at a time, of areas of the sheet that correspond respectively to the device chips and applying a voltage to the probe thereby to release the sheet from the device chips that have attracted the sheet.

公开(公告)号：US20190217440A1

公开(公告)日：2019-07-18

申请号：US16246724

申请日：2019-01-14

申请人： DISCO CORPORATION

发明人： Sakae MATSUZAKI

IPC分类号： B24B41/06 ,  B23Q17/20

CPC分类号： B24B41/068 ,  B23Q17/20

摘要： A support base supports a plate-shaped workpiece. The support base includes a flat plate-shaped box member having a support face for supporting a workpiece and a placement face that is a face on the opposite side to the support face and is placed on a holding face of a chuck table, a temperature measurement unit accommodated in the box member, and a battery accommodated in the box member and serving as a power supply for the temperature measurement unit. The temperature measurement unit includes a temperature measuring instrument that measures a temperature at the support face, and a recording unit that records the temperature measured by the temperature measuring instrument.