公开(公告)号：US20230345653A1

公开(公告)日：2023-10-26

申请号：US18177127

申请日：2023-03-02

Applicant: Delta Electronics (Shanghai) Co.,Ltd.

Inventor： Lin LAN ,  Jing RONG ,  Weiqiang ZHANG

IPC: H05K5/02

CPC classification number: H05K5/0217

Abstract: The disclosure provides a compressing structure for compressing a component, a power module and a method for compressing a component inside a chamber, the compressing structure is provided for compressing a component onto a fixed plate and comprises a plate-shaped structure, the component is secured to a first side of the plate-shaped structure, the outside of the plate-shaped structure is provided with a base; at least a steering compressing member is provided between a second side of the plate-shaped structure and the base, and mounted on the second side of the plate-shaped structure or the base, the steering compressing member is provided for transforming an rotational motion into a translational motion; and at least a positioning device mounted on the side of the plate-shaped structure and the base. The compressing structure provided by the disclosure compresses the component onto the fixed plate.

公开(公告)号：US20220149743A1

公开(公告)日：2022-05-12

申请号：US17449090

申请日：2021-09-28

Applicant: Delta Electronics (Shanghai) Co.,Ltd.

Inventor： Lin LAN ,  Weiqiang ZHANG ,  Yicong XIE ,  Quanliang ZHANG ,  Jing RONG ,  Wei ZHOU

IPC: H02M3/335 ,  H02M3/00 ,  H05K7/20 ,  H05K7/14

Abstract: The invention discloses a power module and a power conversion device. The power module includes a primary converting unit including a first active device unit; a secondary converting unit including a second active device unit; a transformer including a primary unit connected to the primary converting unit and a secondary unit connected to the secondary converting unit; a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed; and an insulating plate including an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body.