公开(公告)号：US5431803A

公开(公告)日：1995-07-11

申请号：US141483

申请日：1993-10-22

申请人： Dino F. DiFranco ,  Shiuh-kao Chiang ,  Craig J. Hasegawa

发明人： Dino F. DiFranco ,  Shiuh-kao Chiang ,  Craig J. Hasegawa

IPC分类号： C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  H05K3/38

CPC分类号： C25D3/38 ,  C25D1/04 ,  H05K1/09 ,  H05K2201/0355 ,  H05K3/382 ,  Y10T428/12 ,  Y10T428/12431

摘要： This invention is directed to a controlled low profile electrodeposited copper foil. In one embodiment this foil has a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns. In one embodiment this foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi and an elongation measured at 180.degree. C. of about 15% to about 28%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) flowing an electrolyte solution between an anode and a cathode and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; said electrolyte solution comprising copper ions, sulfate ions and at least one organic additive or derivative thereof, the chloride ion concentration of said solution being up to about 1 ppm; the current density being in the range of about 0.1 to about 5 A/cm.sup.2 ; and (B) removing copper foil from said cathode.

摘要翻译： 本发明涉及一种受控的低剖面电沉积铜箔。 在一个实施方案中，该箔具有基本上均匀的随机取向的晶粒结构，其基本上是无柱形的和双边界自由的并且具有高达约10微米的平均晶粒尺寸。 在一个实施方案中，该箔具有在23℃下在约87,000至约120,000psi的范围内测量的极限拉伸强度，并且在180℃下测量的伸长率为约15％至约28％。 本发明还涉及一种制备上述箔的方法，该方法包括：（A）在阳极和阴极之间流动电解质溶液，并在所述阳极和所述阴极之间施加有效量的电压以在所述阴极上沉积铜 ; 所述电解质溶液包含铜离子，硫酸根离子和至少一种有机添加剂或其衍生物，所述溶液的氯离子浓度高达约1ppm; 电流密度在约0.1至约5A / cm2的范围内; 和（B）从所述阴极去除铜箔。