公开(公告)号：US20240198480A1

公开(公告)日：2024-06-20

申请号：US18519827

申请日：2023-11-27

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Keita YAGI ,  Akira NAKAMURA ,  Kodai SHIRAKAWA

IPC: B24B49/05 ,  B24B49/16

CPC classification number: B24B49/05 ,  B24B49/16

Abstract: A method capable of accurately obtaining polishing-rate responsiveness to a change in pressure for pressing a workpiece, such as a wafer, against a polishing pad is disclosed. The method includes: creating an estimated polishing-rate responsiveness profile using simulation, the estimated polishing-rate responsiveness profile indicating a distribution of polishing-rate responsiveness to pressure change in the first pressure chamber; creating an actual polishing-rate responsiveness profile using polishing results of a workpiece, the actual polishing-rate responsiveness profile indicating a distribution of polishing-rate responsiveness to pressure change in the second pressure chamber, and creating a hybrid polishing-rate responsiveness profile by combining the estimated polishing-rate responsiveness profile and the actual polishing-rate responsiveness profile.