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1.
公开(公告)号:US20220302438A1
公开(公告)日:2022-09-22
申请号:US17834838
申请日:2022-06-07
Applicant: ELECTROVAYA INC.
Inventor: Rajshekar DAS GUPTA , Elmira MEMARZADEH , Sankar DAS GUPTA , Bjorn Haugseter , Tom Henriksen , Lars Ole Valøen , Akhilesh Kumar Srivastava
IPC: H01M4/36 , H01M4/136 , H01M4/04 , H01M4/131 , H01M4/485 , H01M4/505 , H01M4/525 , H01M4/58 , H01M4/139 , H01M10/058 , H01M10/0525 , H01M4/62 , H01M4/13915 , H01M4/1391
Abstract: The present disclosure relates generally to an electrode produced with a non-toxic solvent, resulting in a homogeneous mixture with uniform distributions of a conductive additive and a binder. Electrodes produced according to the present disclosure feature narrow binder particle size distribution, which distinguishes such electrodes from typical electrodes produced via a N-Methyl-Pyrrolidone (NMP) process. The resulting microstructure promotes the flow of current through the electrode and has an improved cycling stability due, in part, to the binder's and the conductive additive's ability to bind with the active material particles used in the fabrication of the electrode.
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2.
公开(公告)号:US20190267616A1
公开(公告)日:2019-08-29
申请号:US16288859
申请日:2019-02-28
Applicant: ELECTROVAYA INC.
Inventor: Rajshekar DAS GUPTA , Elmira MEMARZADEH , Sankar DAS GUPTA , Bjorn Haugseter , Tom Henriksen , Lars Ole Valøen , Akhilesh Kumar Srivastava
IPC: H01M4/36 , H01M4/62 , H01M4/136 , H01M4/04 , H01M4/131 , H01M4/485 , H01M4/505 , H01M4/525 , H01M4/58 , H01M4/139 , H01M10/058 , H01M10/0525 , H01M4/13915 , H01M4/1391
Abstract: The present disclosure relates generally to an electrode produced with a non-toxic solvent, resulting in a homogeneous mixture with uniform distributions of a conductive additive and a binder. Electrodes produced according to the present disclosure feature narrow binder particle size distribution, which distinguishes such electrodes from typical electrodes produced via a N-Methyl-Pyrrolidone (NMP) process. The resulting microstructure promotes the flow of current through the electrode and has an improved cycling stability due, in part, to the binder's and the conductive additive's ability to bind with the active material particles used in the fabrication of the electrode.
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