公开(公告)号：US11325342B2

公开(公告)日：2022-05-10

申请号：US16473453

申请日：2017-12-19

Applicant: ENEOS Corporation

Inventor： Tomoyuki Okamura ,  Liang Huang ,  Masahiro Wakayama

IPC: B32B5/12 ,  C09J7/24 ,  B32B7/02 ,  B32B5/08 ,  C09J7/22 ,  B32B5/02 ,  B32B27/12 ,  B32B27/32 ,  C09J7/21 ,  B32B7/022 ,  B32B3/26 ,  C09J7/29

Abstract: A substrate 2 of an adhesive tape 1 includes a mesh structure made of thermoplastic resin. The mesh structure has a structure in which multiple first fibers drawn in a first direction corresponding to a length direction of the adhesive tape and multiple second fibers drawn in a second direction corresponding to a width direction of the adhesive tape are layered or woven. (a) A first fiber has a thickness of 0.04 mm or less, and a width of 0.6 mm or less, (b) a second fiber has a thickness greater than that of the first fiber, and a width greater than or equal to that of the first fiber, (c) the mesh structure has a tensile strength in the first direction of from 130 to 250 N/50 mm, (d) the mesh structure has a bending resistance in the first direction obtained by a cantilever test of from 40 to 80 mm, and (e) the mesh structure has a bending resistance in the second direction obtained by the cantilever test of from 65 to 95 mm.