公开(公告)号：US20190131208A1

公开(公告)日：2019-05-02

申请号：US16095636

申请日：2017-02-16

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner ,  Günter Pudmich ,  Werner Rollett ,  Michael Weilguni

IPC: H01L23/373 ,  H01L23/498 ,  H05K1/03 ,  H01L33/62 ,  F21S41/141 ,  B60Q1/04

Abstract: A multi-layer carrier system and a method for producing a multi-layer carrier system are disclosed. In an embodiment a multi-layer carrier system includes at least one multi-layer ceramic substrate and at least one matrix module of heat-producing semiconductor components, wherein the semiconductor components are arranged on the multi-layer ceramic substrate, and wherein the matrix module is electrically conductively connected to a driver circuit by way of the multi-layer ceramic substrate.