公开(公告)号：US20230275354A1

公开(公告)日：2023-08-31

申请号：US18083169

申请日：2022-12-16

Applicant: Electronics and Telecommunications Research Institute

Inventor： JAEHO LEE ,  Jang Yeol KIM ,  Jung Hoon OH ,  HYUNJOON LEE ,  In Kui CHO

IPC: H01Q13/20 ,  H01Q1/48

CPC classification number: H01Q13/206 ,  H01Q1/48

Abstract: Provided is a microstrip array antenna including a dielectric substrate, a feed line formed on a top surface of the dielectric substrate, a plurality of radiation elements formed on the top surface of the dielectric substrate and electrically connected to the feed line, and a ground surface formed on a bottom surface of the dielectric substrate. At least one radiation element among the plurality of radiation elements may have a bottleneck shape.