公开(公告)号：US11665484B2

公开(公告)日：2023-05-30

申请号：US17507927

申请日：2021-10-22

Applicant: Fortemedia, Inc.

Inventor： Li-Jen Chen ,  Yu-Min Fu ,  Yu-Ting Cheng ,  Shih-Chin Gong

IPC: H04R19/00 ,  B81B3/00 ,  H04R9/06

CPC classification number: H04R19/005 ,  B81B3/0018 ,  H04R9/06 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R2201/003

Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.

公开(公告)号：US11051106B2

公开(公告)日：2021-06-29

申请号：US16396978

申请日：2019-04-29

Applicant: Fortemedia, Inc.

Inventor： Li-Jen Chen ,  Yu-Min Fu ,  Yu-Ting Cheng ,  Shih-Chin Gong

IPC: H04R1/00 ,  H04R7/02 ,  H05K1/18 ,  H04R9/02 ,  H01F27/28

Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.