公开(公告)号：US20240365454A1

公开(公告)日：2024-10-31

申请号：US18139346

申请日：2023-04-25

申请人： FENG-CHOU LIN

发明人： FENG-CHOU LIN

IPC分类号： H05B47/105 ,  G06F3/16 ,  H04R3/06 ,  H04R19/04 ,  H05B45/30

CPC分类号： H05B47/105 ,  G06F3/165 ,  H04R3/06 ,  H04R19/04 ,  H05B45/30 ,  G08B5/36 ,  G08B6/00 ,  H04R2201/003

摘要： A system for generating situational effects of live real-time sound receiving and application method thereof, comprises: a situational effect controller provided with a plurality of control keys to control different situational effect items, and simultaneously outputs relative situational coding signals to a sound mixer device for mixing sound, then outputs a first audio signal from a live speaker, and a microphone sound receiving module of the situational effect generator can receive a first audio signal of a live environment, which is decoded and read through a situational decoding unit module and generate a corresponding first control signal and a second audio signal to trigger a situational action module to generate a relative situational action. In this way, it can be used in various parties, concerts, movie theaters, or nightclubs, etc., to capture live environmental audio.

公开(公告)号：US20240365048A1

公开(公告)日：2024-10-31

申请号：US18766577

申请日：2024-07-08

申请人： xMEMS Labs, Inc.

发明人： Chao-Yu Chen ,  Wen-Chien Chen ,  Chiung C. Lo ,  Hai-Hung Wen

IPC分类号： H04R1/28 ,  B81B7/00 ,  H04R1/02 ,  H04R19/02

CPC分类号： H04R1/2811 ,  B81B7/0061 ,  H04R1/023 ,  H04R1/025 ,  H04R19/02 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  H04R2201/003

摘要： A sound producing package includes a substrate, a covering structure and a sound producing component. The covering structure is disposed on the substrate, wherein the covering structure has a plurality of first openings. The sound producing component is disposed between the substrate and the covering structure, wherein the sound producing component includes a membrane and an actuator, and the sound producing component is configured to generate an acoustic wave.

公开(公告)号：US12133049B2

公开(公告)日：2024-10-29

申请号：US18371488

申请日：2023-09-22

申请人： InvenSense, Inc.

发明人： Roberto Brioschi ,  Kazunori Hayata ,  Jr-Cheng Yeh ,  Dinesh Kumar Solanki

IPC分类号： H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/04 ,  H04R3/00

CPC分类号： H04R19/04 ,  B81B7/0064 ,  B81C1/00333 ,  H04R1/04 ,  H04R3/00 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C2203/0109 ,  H04R2201/003

摘要： A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

公开(公告)号：US20240323591A1

公开(公告)日：2024-09-26

申请号：US18609732

申请日：2024-03-19

申请人： Infineon Technologies AG

发明人： Christian Bretthauer

IPC分类号： H04R1/28 ,  H04R1/02 ,  H04R3/04 ,  H04R17/00

CPC分类号： H04R1/2811 ,  H04R1/025 ,  H04R3/04 ,  H04R17/00 ,  H04R2201/003

摘要： A speaker device comprises a housing having an acoustic aperture, a transducer element in the housing configured to receive a first actuation signal and to generate an acoustic output signal. The speaker device comprises a shutter element in the housing configured to receive a second actuation signal and arranged laterally offset to the transducer in the housing. The shutter element is arranged in an acoustic path between the transducer element and the acoustic aperture and comprises a shutter portion movable in opposite directions in response to the second actuation signal. A controller provides the first actuation signal to the transducer element, while the first actuation signal has an ultrasonic signal component modulated with an audio signal component. The controller provides the second actuation signal to the shutter element that has half the frequency of the ultrasonic signal component.

公开(公告)号：US12096170B2

公开(公告)日：2024-09-17

申请号：US18328311

申请日：2023-06-02

申请人： TDK Corporation

发明人： Pirmin Hermann Otto Rombach ,  Dennis Mortensen

IPC分类号： H04R1/08

CPC分类号： H04R1/08 ,  H04R2201/003

摘要： A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a method includes fabricating a microphone component having a backplate and a membrane in a MEMS technology, forming a plurality of holes in the membrane, the holes having diameters smaller than 5 μm, choosing a value for a low frequency roll-off and a diameter of the holes in the membrane and choosing a number of holes such that the chosen value for low frequency roll-off is achieved.

公开(公告)号：US20240298119A1

公开(公告)日：2024-09-05

申请号：US18177579

申请日：2023-03-02

申请人： Infineon Technologies AG

发明人： Andreas Wiesbauer ,  Jose Luis Ceballos ,  Fulvio Ciciotti ,  Benno Muehlbacher ,  Maria Tzitzilaki ,  Mohammed Farag Nouraldin Hassan

IPC分类号： H04R19/00 ,  H03F3/187 ,  H04R3/06

CPC分类号： H04R19/005 ,  H03F3/187 ,  H04R3/06 ,  H03F2200/03 ,  H04R2201/003

摘要： In accordance with an embodiment, a circuit includes a differential amplifier having inputs configured to be coupled to an output of a differential microelectromechanical systems (MEMS) device; a common mode coupling circuit coupled to an output of the differential amplifier; and an amplifier having an input coupled to an output of the common mode coupling circuit and an output configured to be AC coupled to a bias input node of the differential MEMS device.

公开(公告)号：US12069455B2

公开(公告)日：2024-08-20

申请号：US17304373

申请日：2021-06-19

申请人： GMEMS TECH SHENZHEN LIMITED

发明人： Guanghua Wu ,  Xingshuo Lan

IPC分类号： H04R31/00 ,  B81B7/02 ,  B81C1/00 ,  H04R19/04

CPC分类号： H04R31/00 ,  B81B7/02 ,  B81C1/00182 ,  H04R19/04 ,  H04R2201/003

摘要： The present invention provides a process for fabricating a capacitive microphone such as a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm may be so fabricated that it moves in a lateral manner relative to a fixed backplate, instead of moving toward/from the fixed backplate. The fixed backplate may be so fabricated that it includes an electrical insulator sandwiched between two sub-conductors to cancel systematic/background noise. The squeeze film damping is substantially avoided, and the performance, such as signal to noise ratio, of the fabricated microphone is significantly improved.

公开(公告)号：US12069430B2

公开(公告)日：2024-08-20

申请号：US17412238

申请日：2021-08-25

申请人： INVENSENSE, INC.

发明人： Stefano Valle ,  Igor Mucha ,  Alessandro Magnani

IPC分类号： H04R19/04 ,  B81B7/00 ,  H04R19/00

CPC分类号： H04R19/04 ,  B81B7/008 ,  H04R19/005 ,  B81B2201/0257 ,  H04R2201/003

摘要： Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.

公开(公告)号：US20240259734A1

公开(公告)日：2024-08-01

申请号：US18416751

申请日：2024-01-18

申请人： STMICROELECTRONICS S.r.l.

发明人： Federico VERCESI ,  Fabrizio CERINI ,  Silvia ADORNO

IPC分类号： H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  H04R19/00 ,  H04R31/00

CPC分类号： H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003

摘要： Capacitive, MEMS-type acoustic transducer, having a sound collection part and a transduction part. A substrate region surrounds a first chamber arranged in the sound collection part and open towards the outside; a fixed structure is coupled to the substrate region; a cap region is coupled to the fixed structure. A sensitive membrane is arranged in the sound collection part, is coupled to the fixed structure and faces the first chamber. A transduction chamber is arranged in the transduction part, hermetically closed with respect to the outside and accommodates a detection membrane. An articulated structure extends between the sensitive membrane and the detection membrane, through the walls of the transduction chamber. A fixed electrode faces and is capacitively coupled to the detection membrane. Conducive electrical connection regions extend above the substrate region, into the transduction chamber.

公开(公告)号：US20240236585A1

公开(公告)日：2024-07-11

申请号：US18151628

申请日：2023-01-09

申请人： Infineon Technologies AG

发明人： Hong Chen ,  Benno Muehlbacher ,  Michael Reinhold ,  Juergen Roeber ,  Andreas Wiesbauer

IPC分类号： H04R19/00 ,  H04R3/04

CPC分类号： H04R19/005 ,  H04R3/04 ,  H04R2201/003

摘要： A microphone includes a first resistor circuit for receiving a bias voltage; an offset reduction circuit coupled to the first resistor circuit; a second resistor circuit coupled to the offset reduction circuit; an amplifier coupled to the second resistor circuit configured for receiving an input signal and generating an output signal; and a capacitor circuit coupled to the amplifier, the offset reduction circuit, and the second resistor circuit.