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公开(公告)号：US20190355402A1
公开(公告)日：2019-11-21
申请号：US15983263
申请日：2018-05-18
Applicant: GLOBALFOUNDRIES INC.
Inventor： Wuyang HAO , Jack T. WONG , Chunsung CHIANG
IPC: G11C11/16
Abstract: The present disclosure relates to a structure which includes a merged write driver circuit with a first device next to a first memory array and a second device next to a second memory array, and the merged write driver circuit being configured to share a write driver line between the first device and the second device.
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