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1.
公开(公告)号:US10332897B2
公开(公告)日:2019-06-25
申请号:US16133176
申请日:2018-09-17
Applicant: GLOBALFOUNDRIES INC.
Inventor: Xiaoqiang Zhang , Hui Zang , Ratheesh R. Thankalekshmi , Randy W. Mann
Abstract: Various aspects include a static random access memory (SRAM) bitcell array structure. In some cases, the SRAM bitcell array structure includes at least one fin in an array of fins in a substrate, where a width of a first portion of the at least one fin is less than a width of a second portion of the at least one fin in the array of fins.
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2.
公开(公告)号:US10163914B2
公开(公告)日:2018-12-25
申请号:US15603827
申请日:2017-05-24
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Xiaoqiang Zhang , Hui Zang , Ratheesh R. Thankalekshmi , Randy W. Mann
Abstract: A method of reducing fin width in an integrated circuit (IC) including oxidizing an exposed portion of at least one fin in an array of fins resulting in a reduction in the width of the exposed portion of the at least one fin. A first hard mask may be located over the array of fins except the exposed portion of the at least one fin during oxidation. A second hard mask may be optionally located over the array of fins, under the first hard mask, and covering a portion of the exposed portion of the at least one fin during the oxidizing of the exposed portion of the at least one fin. The oxidizing the exposed portion of the at least one fin may occur before forming a shallow trench isolation (STI) between pairs of fins in the array of fins, after forming the STI between the pairs of fins in the array of fins, and/or after removing a dummy gate during a replacement metal gate process.
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3.
公开(公告)号:US20190019798A1
公开(公告)日:2019-01-17
申请号:US16133176
申请日:2018-09-17
Applicant: GLOBALFOUNDRIES INC.
Inventor: Xiaoqiang Zhang , Hui Zang , Ratheesh R. Thankalekshmi , Randy W. Mann
CPC classification number: H01L27/1104 , H01L27/0207 , H01L29/66545 , H01L29/66818
Abstract: Various aspects include a static random access memory (SRAM) bitcell array structure. In some cases, the SRAM bitcell array structure includes at least one fin in an array of fins in a substrate, where a width of a first portion of the at least one fin is less than a width of a second portion of the at least one fin in the array of fins.
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4.
公开(公告)号:US20180261605A1
公开(公告)日:2018-09-13
申请号:US15603827
申请日:2017-05-24
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Xiaoqiang Zhang , Hui Zang , Ratheesh R. Thankalekshmi , Randy W. Mann
CPC classification number: H01L27/1104 , H01L29/66545 , H01L29/66818
Abstract: A method of reducing fin width in an integrated circuit (IC) including oxidizing an exposed portion of at least one fin in an array of fins resulting in a reduction in the width of the exposed portion of the at least one fin. A first hard mask may be located over the array of fins except the exposed portion of the at least one fin during oxidation. A second hard mask may be optionally located over the array of fins, under the first hard mask, and covering a portion of the exposed portion of the at least one fin during the oxidizing of the exposed portion of the at least one fin. The oxidizing the exposed portion of the at least one fin may occur before forming a shallow trench isolation (STI) between pairs of fins in the array of fins, after forming the STI between the pairs of fins in the array of fins, and/or after removing a dummy gate during a replacement metal gate process.
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