公开(公告)号：US10566300B2

公开(公告)日：2020-02-18

申请号：US15876734

申请日：2018-01-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Scott Pozder ,  Thiagarajan Raman ,  Kristina Young-Fisher ,  David Stone

IPC: H01L29/00 ,  H01L23/00

Abstract: Bond pad structures and methods for fabricating bond pad structures. A bond pad and a plurality of fill lines are formed on the top surface of a dielectric layer. The fill lines are arranged on the top surface of the dielectric layer adjacent to the bond pad, and may be separated from the bond pad by a fill keep-out zone. One or more Under Bump Metallurgy (UBM) layers may be arranged on the bond pad and may extend outwardly to overlap with the fill lines.

公开(公告)号：US20190229079A1

公开(公告)日：2019-07-25

申请号：US15876734

申请日：2018-01-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Scott Pozder ,  Thiagarajan Raman ,  Kristina Young-Fisher ,  David Stone

IPC: H01L23/00

Abstract: Bond pad structures and methods for fabricating bond pad structures. A bond pad and a plurality of fill lines are formed on the top surface of a dielectric layer. The fill lines are arranged on the top surface of the dielectric layer adjacent to the bond pad, and may be separated from the bond pad by a fill keep-out zone. One or more Under Bump Metallurgy (UBM) layers may be arranged on the bond pad and may extend outwardly to overlap with the fill lines.