公开(公告)号：US20220137290A1

公开(公告)日：2022-05-05

申请号：US17087182

申请日：2020-11-02

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Abdelsalam A. ABOKETAF ,  Won Suk LEE ,  Yusheng BIAN

IPC: G02B6/028 ,  G02B6/122

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to multi-mode optical waveguide structures with isolated absorbers and methods of manufacture. The structure includes: a waveguide structure including tapered segments; and at least one isolated waveguide absorber adjacent to the waveguide structure along its length.

公开(公告)号：US20220003931A1

公开(公告)日：2022-01-06

申请号：US16919867

申请日：2020-07-02

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Yusheng BIAN ,  Won Suk LEE ,  Abdelsalam A. ABOKETAF

IPC: G02B6/26

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.

公开(公告)号：US20210125922A1

公开(公告)日：2021-04-29

申请号：US16666808

申请日：2019-10-29

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Tung-Hsing LEE ,  Teng-Yin LIN ,  Frank W. MONT ,  Edward J. GORDON ,  Asmaa ELKADI ,  Alexander MARTIN ,  Won Suk LEE ,  Anvitha SHAMPUR

IPC: H01L23/522 ,  H01L49/02 ,  H01F27/28 ,  H01F27/24 ,  H01F41/04

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.

公开(公告)号：US20220283375A1

公开(公告)日：2022-09-08

申请号：US17749487

申请日：2022-05-20

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Yusheng BIAN ,  Won Suk LEE ,  Abdelsalam A. ABOKETAF

IPC: G02B6/26 ,  G02B6/122

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.

公开(公告)号：US20210223473A1

公开(公告)日：2021-07-22

申请号：US16749363

申请日：2020-01-22

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Yusheng BIAN ,  Ajey Poovannummoottil JACOB ,  Won Suk LEE

IPC: G02B6/122

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to waveguide absorbers and methods of manufacture. A structure includes: a photonics component; and a vanadate waveguide absorber adjacent to the photonics component