公开(公告)号：US20190281390A1

公开(公告)日：2019-09-12

申请号：US16319005

申请日：2016-12-20

Applicant: GOERTEK INC.

Inventor： Xiaodong GUO ,  Guangtao TIAN

IPC: H04R7/14 ,  H04R9/06

Abstract: A speaker diaphragm and a molding method therefor are provided. The speaker diaphragm comprises: a lead wire; a lead wire enclosure portion, wherein the lead wire enclosure portion has a membrane part and support protrusions, the support protrusions are distributed on a surface of the membrane part, the thickness of the membrane part is larger than or equal to the diameter of the lead wire, the thickness of the overall lead wire enclosure portion is larger than the diameter of the lead wire, and a part of the lead wire is injection-molded in the lead wire enclosure portion; and a diaphragm layer, wherein the diaphragm layer is configured to form an overall structure of the speaker diaphragm, the thickness of the diaphragm layer is larger than or equal to the thickness of the overall lead wire enclosure portion, and the lead wire enclosure portion is injection-molded in the diaphragm layer.