公开(公告)号：US20210135044A1

公开(公告)日：2021-05-06

申请号：US16605081

申请日：2017-04-19

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Xiaoyang ZHANG ,  Peixuan CHEN ,  Xiangxu FENG ,  Tao GAN ,  Zhe WANG

IPC: H01L33/00 ,  H01L25/075

Abstract: It is disclosed a micro-LED transfer method, manufacturing method and display device. The method for transferring a micro-LED array comprises: patterning conductive resist on a receiving substrate to cover electrodes for the micro-LED array to be transferred; bonding the micro-LED array on a first substrate with the receiving substrate through the conductive resist, wherein the first substrate is laser transparent; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate. According to an embodiment, the performance of a micro-LED device may be improved.

公开(公告)号：US20200219855A1

公开(公告)日：2020-07-09

申请号：US16643307

申请日：2017-07-24

Applicant: GOERTEK INC.

Inventor： Peixuan CHEN ,  Quanbo ZOU ,  Xiangxu FENG ,  Tao GAN ,  Xiaoyang ZHANG

IPC: H01L25/075 ,  H01L21/78 ,  H01L33/48 ,  G09F9/33 ,  H01L33/00 ,  H01L21/683

Abstract: A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).