公开(公告)号：US20240111088A1

公开(公告)日：2024-04-04

申请号：US17936939

申请日：2022-09-30

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Ryan William Sporer

IPC: G02B6/12 ,  G02B6/13

CPC classification number: G02B6/12004 ,  G02B6/13 ,  G02B2006/12061

Abstract: A structure or PIC structure includes a hybrid plasmonic (HP) waveguide. The HP waveguide includes a waveguide core, and a metal silicide layer contacting the waveguide core. The metal silicide layer replaces noble metals typically provided in hybrid plasmonic waveguides, providing improved optical signal containment characteristics. The metal silicide layer is also compatible with CMOS fabrication techniques, and capable of additional scaling with other CMOS structures. The HP waveguide also has a reduce form factor compared to conventional HP waveguides, providing room for more waveguides closer together.