Test then destroy technique for security-focused semiconductor integrated circuits
    2.
    发明授权
    Test then destroy technique for security-focused semiconductor integrated circuits 有权
    测试然后破坏安全性半导体集成电路的技术

    公开(公告)号:US09343377B1

    公开(公告)日:2016-05-17

    申请号:US14592249

    申请日:2015-01-08

    Applicant: Google Inc.

    CPC classification number: H01L21/76892 G01R31/31719 H01L22/14 H01L22/20

    Abstract: A method includes forming an integrated circuit device having device circuitry disposed in a device circuitry area on a substrate and a destroyable circuit formed in a destroyable circuitry area on the substrate; testing at least one operational aspect of the device circuitry using the destroyable circuit; and destroying the destroyable circuit subsequent to testing the at least one operational aspect of the device circuitry.

    Abstract translation: 一种方法包括形成集成电路装置,其具有设置在衬底上的器件电路区域中的器件电路和形成在衬底上的可破坏电路区域中的可破坏电路; 使用可破坏电路测试设备电路的至少一个操作方面; 以及在测试所述设备电路的至少一个操作方面之后破坏所述可破坏的电路。

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