公开(公告)号：US20220381975A1

公开(公告)日：2022-12-01

申请号：US17330512

申请日：2021-05-26

Applicant: Google LLC

Inventor： Lieven Verslegers ,  Ryohei Urata ,  Mohammad Sotoodeh ,  Liming Wang

IPC: G02B6/124 ,  G02B6/34 ,  H04B10/40

Abstract: A photonic integrated circuit (PIC) includes one or more couplers to interface a light source with the PIC, a splitter directly coupled to the one or more couplers at a coupling point of the PIC, a modulator to receive light from the couplers, and a connecting waveguide to connect the splitter to the modulator. The waveguide may be a rib waveguide. The PIC may be integrated with devices such as a CWDM or a PSM device, and may provide improved performance and lower attention for high optical power applications.

公开(公告)号：US20190107673A1

公开(公告)日：2019-04-11

申请号：US16131594

申请日：2018-09-14

Applicant: Google LLC

Inventor： Lieven Verslegers ,  Mohammad Sotoodeh ,  Ryohei Urata

IPC: G02B6/126 ,  G02B6/122

Abstract: Silicon-on-insulator photonic integrated circuits (PICs) are provided. A PIC can include a silicon dioxide substrate surrounding a silicon waveguide. The silicon waveguide has a thickness between an upper side and a lower side and a width between lateral sides. The thickness and width can be set such that a first group index of a lowest-order TE mode of an optical signal is approximately equal to a second group index of a lowest-order TM mode of the optical signal.