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公开(公告)号:US20220381975A1
公开(公告)日:2022-12-01
申请号:US17330512
申请日:2021-05-26
Applicant: Google LLC
Inventor: Lieven Verslegers , Ryohei Urata , Mohammad Sotoodeh , Liming Wang
Abstract: A photonic integrated circuit (PIC) includes one or more couplers to interface a light source with the PIC, a splitter directly coupled to the one or more couplers at a coupling point of the PIC, a modulator to receive light from the couplers, and a connecting waveguide to connect the splitter to the modulator. The waveguide may be a rib waveguide. The PIC may be integrated with devices such as a CWDM or a PSM device, and may provide improved performance and lower attention for high optical power applications.
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公开(公告)号:US20190107673A1
公开(公告)日:2019-04-11
申请号:US16131594
申请日:2018-09-14
Applicant: Google LLC
Inventor: Lieven Verslegers , Mohammad Sotoodeh , Ryohei Urata
Abstract: Silicon-on-insulator photonic integrated circuits (PICs) are provided. A PIC can include a silicon dioxide substrate surrounding a silicon waveguide. The silicon waveguide has a thickness between an upper side and a lower side and a width between lateral sides. The thickness and width can be set such that a first group index of a lowest-order TE mode of an optical signal is approximately equal to a second group index of a lowest-order TM mode of the optical signal.
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