公开(公告)号：US20230052653A1

公开(公告)日：2023-02-16

申请号：US17979176

申请日：2022-11-02

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H01L23/367 ,  H05K7/20 ,  H04R1/02

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US12176260B2

公开(公告)日：2024-12-24

申请号：US17979176

申请日：2022-11-02

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H05K7/20 ,  H01L23/367 ,  H04R1/02

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US20210111095A1

公开(公告)日：2021-04-15

申请号：US17065285

申请日：2020-10-07

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H01L23/367 ,  H01L25/18 ,  H01L23/552 ,  H04R1/02

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US11521909B2

公开(公告)日：2022-12-06

申请号：US17065285

申请日：2020-10-07

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H01L23/367 ,  H01L23/552 ,  H04R1/02 ,  H05K7/20

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.