公开(公告)号：US12050190B2

公开(公告)日：2024-07-30

申请号：US18312477

申请日：2023-05-04

Applicant: Google LLC

Inventor： David Wang ,  Arun Raghupathy ,  James Robert Lim ,  Ihab A. Ali ,  Chang Hong Ye

IPC: G01N25/72 ,  G01R31/371 ,  G01R31/392 ,  H01M10/615 ,  H01M10/63

CPC classification number: G01N25/72 ,  G01R31/371 ,  G01R31/392 ,  H01M10/615 ,  H01M10/63

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

公开(公告)号：US20240155818A1

公开(公告)日：2024-05-09

申请号：US18504485

申请日：2023-11-08

Applicant: Google LLC

Inventor： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

IPC: H05K7/20 ,  G01R31/28 ,  G06F3/16 ,  H04R9/02 ,  H05K1/02

CPC classification number: H05K7/20945 ,  G01R31/2877 ,  G06F3/165 ,  H04R9/022 ,  H05K1/0203 ,  H04R1/02

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

公开(公告)号：US11812583B2

公开(公告)日：2023-11-07

申请号：US17064372

申请日：2020-10-06

Applicant: Google LLC

Inventor： Frédéric Heckmann ,  Ihab A. Ali

IPC: H05K7/20 ,  F28F21/08 ,  F28F21/02 ,  F28D21/00

CPC classification number: H05K7/20445 ,  F28F21/02 ,  F28F21/084 ,  H05K7/20509 ,  F28D2021/0029

Abstract: This document describes a passive thermal-control system that is integrated into a mesh network device. The passive thermal-control system, which may include a heat sink and multiple heat spreaders, is such that heat originating with integrated circuit devices of the mesh network device and a speaker module of the mesh network device may be transferred to other components of the mesh network device, such as a housing component of the mesh network device. The heat may then be dissipated to an external environment to maintain a desired thermal profile of the mesh network device.

公开(公告)号：US11785744B2

公开(公告)日：2023-10-10

申请号：US17728351

申请日：2022-04-25

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.

公开(公告)号：US11680918B2

公开(公告)日：2023-06-20

申请号：US17032679

申请日：2020-09-25

Applicant: Google LLC

Inventor： David Wang ,  Arun Raghupathy ,  James Robert Lim ,  Ihab A. Ali ,  Chang Hong Ye

IPC: G01N25/72 ,  G01R31/371 ,  G01R31/392

CPC classification number: G01N25/72 ,  G01R31/371 ,  G01R31/392

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

公开(公告)号：US20230052653A1

公开(公告)日：2023-02-16

申请号：US17979176

申请日：2022-11-02

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H01L23/367 ,  H05K7/20 ,  H04R1/02

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US20240397669A1

公开(公告)日：2024-11-28

申请号：US18794812

申请日：2024-08-05

Applicant: Google LLC

Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

IPC: H05K7/20 ,  H04R1/02

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and can provide both thermal mitigation and structural stability. The passive thermal-control structure can conduct heat from the electronic subsystems to a housing of the electronic speaker device.

公开(公告)号：US12082377B2

公开(公告)日：2024-09-03

申请号：US17407789

申请日：2021-08-20

Applicant: Google LLC

Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

IPC: H04R1/02 ,  H05K7/20

CPC classification number: H05K7/20418 ,  H04R1/025 ,  H05K7/20481 ,  H05K7/205 ,  H05K7/20509 ,  H05K7/20409

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

公开(公告)号：US11867386B2

公开(公告)日：2024-01-09

申请号：US17662827

申请日：2022-05-10

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: F21V29/70 ,  F21V33/00 ,  F21V29/87 ,  H05B45/18 ,  F21V23/02 ,  F21Y115/10

CPC classification number: F21V29/70 ,  F21V23/02 ,  F21V29/87 ,  F21V33/0052 ,  H05B45/18 ,  F21Y2115/10

Abstract: This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

公开(公告)号：US20230139054A1

公开(公告)日：2023-05-04

申请号：US17767683

申请日：2020-10-08

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Frédéric Heckmann

IPC: H05K7/20 ,  H05K1/02 ,  H05K9/00

Abstract: This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.