公开(公告)号：US20210178666A1

公开(公告)日：2021-06-17

申请号：US17049874

申请日：2018-08-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Adrien CHIRON ,  Mohammad JOWKAR ,  Diego Javier MOSTACCIO

IPC: B29C64/153 ,  B29C64/165

Abstract: According to one example, there is provided a method of preparing build material in a build material supply module. The method comprises moving a supply platform within a build material supply module in a predetermined manner to compact build material within the supply module.

公开(公告)号：US20180133971A1

公开(公告)日：2018-05-17

申请号：US15564377

申请日：2015-07-22

Applicant: Pere Tuset ,  Diego Javier Mostaccio ,  Hewlett-Packard Development Company, L.P. ,  Xavier Vilajosana

Inventor： Xavier VILAJOSANA ,  Pere TUSET ,  Diego Javier MOSTACCIO

IPC: B29C64/393 ,  B29C35/02 ,  G05D23/27

CPC classification number: B29C64/393 ,  B29C35/0288 ,  B29C64/386 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  G05D23/27

Abstract: A method for thermal control in an additive manufacturing system is disclosed: the method including receiving position information from an encoder device, receiving a data stream from a thermal sensing device, filtering the data stream based on the position information and building a temperature image map from the filtered data stream. A thermal control system and an additive manufacturing system having a thermal control system are also disclosed.