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公开(公告)号:USD797095S1
公开(公告)日:2017-09-12
申请号:US29565261
申请日:2016-05-19
Applicant: Hewlett-Packard Development Company, L.P.
Designer: Michael Delpier , Stacy L. Wolff , Eric Chen , Paul L. Drew , Rudy Widiaman , Jack Godfrey Wood , Marcus Hoggarth , Harc Lee
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公开(公告)号:USD888051S1
公开(公告)日:2020-06-23
申请号:US29646559
申请日:2018-05-04
Applicant: Hewlett-Packard Development Company, L.P.
Designer: David Quijano , Tom J. Searby , Jack Godfrey Wood , Harc Lee , Marcus Hoggarth
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公开(公告)号:USD806702S1
公开(公告)日:2018-01-02
申请号:US29583011
申请日:2016-11-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer: Mark Senatori , Ilchan Lee , Marcus Hoggarth , Jack Godfrey Wood , Stephen de Saulles , Ian Guy , Harc Lee , Sunny Hwang
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公开(公告)号:USD912663S1
公开(公告)日:2021-03-09
申请号:US29647221
申请日:2018-05-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer: Chrome Manley Cebe , Matthew W. Tivnon , Marcus Hoggarth , Jack Godfrey Wood , Oliver Poyntz , Ian Guy , Isaac Teece , Stephen De Saulles
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公开(公告)号:USD895617S1
公开(公告)日:2020-09-08
申请号:US29673960
申请日:2018-12-18
Applicant: Hewlett-Packard Development Company, L.P.
Designer: Joshua Glenn Little , Glenn A. Wong , Jack Godfrey Wood , Seongmin Hwang , Marcus Hoggarth
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公开(公告)号:US20190121405A1
公开(公告)日:2019-04-25
申请号:US16089560
申请日:2016-06-02
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: John Pennington, JR. , Joshua Little , Glenn Wong , Jack Godfrey Wood
Abstract: Examples disclosed herein relate to a heat and sound deflector. An example device includes a housing having a top side; an audio system disposed in the housing to emit sound toward the top side of the housing; a heat dissipation system disposed in the housing to dissipate heat toward the top side of the housing. In examples, a deflector disposed on the top side of the housing is to deflect the sound and the dissipated heat.
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公开(公告)号:USD836110S1
公开(公告)日:2018-12-18
申请号:US35001127
申请日:2016-06-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer: David Quijano , Jonathan D Bassett , Owen Richard , Jack Godfrey Wood , Harc Lee , Marcus Hoggarth
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公开(公告)号:USD832250S1
公开(公告)日:2018-10-30
申请号:US29566884
申请日:2016-06-03
Applicant: Hewlett-Packard Development Company, L.P.
Designer: Glenn A. Wong , Jack Godfrey Wood , Marcus Hoggarth , Matt Leck
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公开(公告)号:USD824895S1
公开(公告)日:2018-08-07
申请号:US29609352
申请日:2017-06-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer: Matthew W. Tivnon , Binh T. Truong , James McClellan , Marcus Hoggarth , Jack Godfrey Wood , Oliver Poyntz , Ian Guy , Isaac Teece , Stephen De Saulles
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公开(公告)号:USD807345S1
公开(公告)日:2018-01-09
申请号:US29582979
申请日:2016-11-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer: Mark Senatori , Ilchan Lee , Marcus Hoggarth , Jack Godfrey Wood , Stephen de Saulles , Ian Guy , Harc Lee , Sunny Hwang
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