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公开(公告)号：US10780698B2
公开(公告)日：2020-09-22
申请号：US16073146
申请日：2016-06-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W Cumbie, Jr. , Chien-Hua Chen , Erik D. Torniainen
Abstract: A fluid ejection die includes a substrate including an array of nozzles.
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