公开(公告)号：US20240172401A1

公开(公告)日：2024-05-23

申请号：US18424887

申请日：2024-01-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chenghua Liu ,  Xiaochu Li ,  Min Luo ,  Xiaolong Yan

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20145

Abstract: A chassis for an edge device includes a cabinet and a heat exchange component. The heat exchange component is disposed in a space enclosed by the cabinet. The space in the cabinet is divided into a first space and a second space for placement an electronic device. The heat exchange component performs heat transfer between the first space and the second space. A first air inlet and a first air outlet are disposed in the first space, and an airflow entering from the first air inlet flows through a first surface of the heat exchange component and exits from the first air outlet.